SBVS225B March   2013  – May 2014 TLC5973

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 Handling Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Typical Characteristics
  7. 7 Parameter Measurement Information
    1. 7.1 Pin-Equivalent Input and Output Schematic Diagrams
    2. 7.2 Test Circuits
    3. 7.3 Timing Diagrams
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Grayscale (GS) Control
      2. 8.3.2 EasySet and Shunt Regulator
      3. 8.3.3 No Limit Cascading
      4. 8.3.4 Constant Sink Current Value
      5. 8.3.5 Connector Design
    4. 8.4 Device Functional Modes
      1. 8.4.1 Grayscale (GS) Function (PWM Control)
        1. 8.4.1.1 PWM Control
      2. 8.4.2 One-Wire Interface (EasySet) Data Writing Method
        1. 8.4.2.1 Data Transfer Rate (tCYCLE) Measurement Sequence
        2. 8.4.2.2 Data ‘0’ and Data ‘1’ Write Sequence (Data Write Sequence)
        3. 8.4.2.3 One Communication Cycle End of Sequence (EOS)
        4. 8.4.2.4 GS Data Latch (GSLAT) Sequence
    5. 8.5 Programming
      1. 8.5.1 Controlling Devices Connected in Series
    6. 8.6 Register Maps
      1. 8.6.1 Register and Data Latch Configuration
  9. 9 Applications and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 No Internal Shunt Regulator Mode 1
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Application Curve
      2. 9.2.2 No Internal Shunt Regulator Mode 2
        1. 9.2.2.1 Design Requirements
        2. 9.2.2.2 Detailed Design Procedure
        3. 9.2.2.3 Application Curve
      3. 9.2.3 Internal Shunt Regulator Mode
        1. 9.2.3.1 Design Requirements
        2. 9.2.3.2 Detailed Design Procedure
        3. 9.2.3.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Trademarks
    2. 12.2 Electrostatic Discharge Caution
    3. 12.3 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

12 Device and Documentation Support

12.1 Trademarks

All trademarks are the property of their respective owners.

12.2 Electrostatic Discharge Caution

esds-image

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

12.3 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms and definitions.