SLLSEY5F October   2017  – May 2022 TLIN1029-Q1

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Description (continued)
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 ESD Ratings - IEC
    4. 7.4 Thermal Information
    5. 7.5 Recommended Operating Conditions
    6. 7.6 Electrical Characteristics
    7. 7.7 Switching Characteristics
    8. 7.8 Timing Requirements
    9. 7.9 Typical Characteristics
  8. 8 Parameter Measurement Information
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1  LIN (Local Interconnect Network) Bus
        1. 9.3.1.1 LIN Transmitter Characteristics
        2. 9.3.1.2 LIN Receiver Characteristics
          1. 9.3.1.2.1 Termination
      2. 9.3.2  TXD (Transmit Input and Output)
      3. 9.3.3  RXD (Receive Output)
      4. 9.3.4  VSUP (Supply Voltage)
      5. 9.3.5  GND (Ground)
      6. 9.3.6  EN (Enable Input)
      7. 9.3.7  Protection Features
      8. 9.3.8  TXD Dominant Time Out (DTO)
      9. 9.3.9  Bus Stuck Dominant System Fault: False Wake-Up Lockout
      10. 9.3.10 Thermal Shutdown
      11. 9.3.11 Under Voltage on VSUP
      12. 9.3.12 Unpowered Device and LIN Bus
    4. 9.4 Device Functional Modes
      1. 9.4.1 Normal Mode
      2. 9.4.2 Sleep Mode
      3. 9.4.3 Standby Mode
      4. 9.4.4 Wake-Up Events
        1. 9.4.4.1 Wake-Up Request (RXD)
        2. 9.4.4.2 Mode Transitions
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedures
        1. 10.2.2.1 Normal Mode Application Note
        2. 10.2.2.2 Standby Mode Application Note
          1. 10.2.2.2.1 TXD Dominant State Timeout Application Note
      3. 10.2.3 Application Curves
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Documentation Support
      1. 13.1.1 Related Documentation
    2. 13.2 Receiving Notification of Documentation Updates
    3. 13.3 Support Resources
    4. 13.4 Trademarks
    5. 13.5 Electrostatic Discharge Caution
    6. 13.6 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.7 Switching Characteristics

parameters valid across -40℃ ≤ TA ≤ 125℃ (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
D112V Duty Cycle 1 (ISO/DIS 17987 Param 27)(1) THREC(MAX) = 0.744 x VSUP, THDOM(MAX) = 0.581 x VSUP, VSUP = 4 V to 7.4 V, tBIT = 50 µs (20 kbps), D1 = tBUS_rec(min)/(2 x tBIT) (See Figure 8-11, Figure 8-12) 0.396
D112V Duty Cycle 1 (2) THREC(MAX) = 0.625 x VSUP, THDOM(MAX) = 0.581 x VSUP, VSUP = 7.4 V to 9.4 V, tBIT = 50 µs (20 kbps), D1 = tBUS_rec(min)/(2 x tBIT) (See Figure 8-11, Figure 8-12) 0.368
D112V Duty Cycle 1 (ISO/DIS 17987 Param 27) THREC(MAX) = 0.744 x VSUP, THDOM(MAX) = 0.581 x VSUP, VSUP = 9.4 V to 18 V, tBIT = 50 µs (20 kbps), D1 = tBUS_rec(min)/(2 x tBIT) (See Figure 8-11, Figure 8-12) 0.396
D212V Duty Cycle 2 (ISO/DIS 17987 Param 28) THREC(MIN) = 0.422 x VSUP, THDOM(MIN) = 0.284 x VSUP, VSUP = 4 V to 7.4 V, tBIT = 50 µs (20 kbps), D2 = tBUS_rec(MAX)/(2 x tBIT) (See Figure 8-11, Figure 8-12) 0.581
D212V Duty Cycle 2 (2) THREC(MIN) = 0.422 x VSUP, THDOM(MIN) = 0.284 x VSUP, VSUP = 7.4 V to 9.4 V, tBIT = 50 µs (20 kbps), D2 = tBUS_rec(MAX)/(2 x tBIT) (See Figure 8-11, Figure 8-12) 0.67
D212V Duty Cycle 2 (ISO/DIS 17987 Param 28) THREC(MIN) = 0.422 x VSUP, THDOM(MIN) = 0.284 x VSUP, VSUP = 9.4 V to 18 V, tBIT = 50 µs (20 kbps), D2 = tBUS_rec(MAX)/(2 x tBIT) (See Figure 8-11, Figure 8-12) 0.581
D312V Duty Cycle 3 (ISO/DIS 17987 Param 29) THREC(MAX) = 0.778 x VSUP, THDOM(MAX) = 0.616 x VSUP, VSUP = 7 V to 18 V, tBIT = 96 µs (10.4 kbps), D3 = tBUS_rec(min)/(2 x tBIT) (See Figure 8-11, Figure 8-12) 0.417
D312V Duty Cycle 3 THREC(MAX) = 0.645 x VSUP, THDOM(MAX) = 0.616 x VSUP, VSUP = 4 V to 7 V, tBIT = 96 µs (10.4 kbps), D3 = tBUS_rec(min)/(2 x tBIT) (See Figure 8-11, Figure 8-12) 0.417
D412V Duty Cycle 4 (ISO/DIS 17987 Param 30) THREC(MIN) = 0.389 x VSUP, THDOM(MIN) = 0.251 x VSUP, VSUP = 4.6 V to 7.4 V, tBIT = 96 µs (10.4 kbps), D4 = tBUS_rec(MAX)/(2 x tBIT) (See Figure 8-11, Figure 8-12) 0.59
D412V Duty Cycle 4 (2) THREC(MIN) = 0.389 x VSUP, THDOM(MIN) = 0.251 x VSUP, VSUP = 7.4 V to 9.4 V, tBIT = 96 µs (10.4 kbps), D4 = tBUS_rec(MAX)/(2 x tBIT) (See Figure 8-11, Figure 8-12) 0.6
D412V Duty Cycle 4 (ISO/DIS 17987 Param 30) THREC(MIN) = 0.389 x VSUP, THDOM(MIN) = 0.251 x VSUP, VSUP = 7.4 V to 18 V, tBIT = 96 µs (10.4 kbps), D4 = tBUS_rec(MAX)/(2 x tBIT) (See Figure 8-11, Figure 8-12) 0.59
(1) Duty cycles: LIN driver bus load conditions (CLIN, RLIN): Load1 = 1 nF, 1 kΩ; Load2 = 10 nF, 500 Ω, Load3 = 6.8 nF, 660 Ω. Duty cycles 3 and 4 are defined for 10.4-kbps operation. The TLIN1029 also meets these lower data rate requirements, while it is capable of the higher speed 20-kbps operation as specified by duty cycles 1 and 2. SAEJ2602 derives propagation delay equations from the LIN 2.0 duty cycle definitions, for details see the SAEJ2602 specification