SLLSFM6 June   2021 TLIN2022A-Q1

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Description (Continued)
  5. 5 Revision History
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 ESD Ratings - IEC
    4. 7.4 Thermal Information
    5. 7.5 Recommended Operating Conditions
    6. 7.6 Electrical Characteristics
    7. 7.7 Duty Cycle Characteristics
    8. 7.8 Switching Characteristics
    9. 7.9 Typical Characteristics
  8. 8 Parameter Measurement Information
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1  LIN (Local Interconnect Network) Bus
        1. 9.3.1.1 LIN Transmitter Characteristics
        2. 9.3.1.2 LIN Receiver Characteristics
          1. 9.3.1.2.1 Termination
      2. 9.3.2  TXD
      3. 9.3.3  RXD (Receive Output)
      4. 9.3.4  VSUP (Supply Voltage)
      5. 9.3.5  GND (Ground)
      6. 9.3.6  EN (Enable Input)
      7. 9.3.7  Protection Features
      8. 9.3.8  TXD Dominant Time Out (DTO)
      9. 9.3.9  Bus Stuck Dominant System Fault: False Wake-Up Lockout
      10. 9.3.10 Thermal Shutdown
      11. 9.3.11 Undervoltage on VSUP
      12. 9.3.12 Unpowered Device and LIN Bus
    4. 9.4 Device Functional Modes
      1. 9.4.1 Normal Mode
      2. 9.4.2 Sleep Mode
      3. 9.4.3 Standby Mode
      4. 9.4.4 Wake-Up Events
        1. 9.4.4.1 Wake-Up Request (RXD)
        2. 9.4.4.2 Mode Transitions
  10. 10Application Information Disclaimer
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedures
        1. 10.2.2.1 Normal Mode Application Note
        2. 10.2.2.2 Standby Mode Application Note
        3. 10.2.2.3 TXD Dominant State Timeout Application Note
      3. 10.2.3 Application Curves
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Support Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6 Pin Configuration and Functions

Figure 6-1 D Package, 14-Pin (SOIC), Top View
Figure 6-2 DMT Package, 14-Pin (VSON), Top View
Table 6-1 Pin Functions
PIN Type DESCRIPTION
NO. NAME
1 RXD1 O Channel 1 RXD Output (open-drain) interface reporting state of LIN bus voltage
2 EN1 I Channel 1 Enable Input- High puts the channel 1 in normal operation mode and low puts it in sleep mode
3 TXD1 I Channel 1 TXD input interface to control state of LIN output
4 RXD2 O Channel 2 RXD Output (open-drain) interface reporting state of LIN bus voltage
5 EN2 I Channel 2 Enable Input- High puts the channel 2 in normal operation mode and low puts it in sleep mode
7 TXD2 I Channel 2 TXD input interface to control state of LIN output
8 GND GND Ground
9 LIN2 HV I/O Channel 2 High voltage LIN bus single-wire transmitter and receiver
10 VSUP Supply Device Supply Voltage (connected to battery in series with external reverse blocking diode)
13 LIN1 HV I/O Channel 1 High voltage LIN bus single-wire transmitter and receiver
6, 11, 12,
14		 NC – Not Connected
Thermal Pad – Can be connected to the PCB ground plane to improve thermal coupling (DMT package only)