SBVS160C May   2011  – January 2023 TLV1117LV

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Internal Current Limit
      2. 7.3.2 Dropout Voltage
      3. 7.3.3 Undervoltage Lockout
    4. 7.4 Device Functional Modes
      1. 7.4.1 Normal Operation
      2. 7.4.2 Dropout Operation
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Input and Output Capacitor Requirements
        2. 8.2.2.2 Transient Response
      3. 8.2.3 Application Curves
    3. 8.3 Best Design Practices
    4. 8.4 Power Supply Recommendations
    5. 8.5 Layout
      1. 8.5.1 Layout Guidelines
        1. 8.5.1.1 Thermal Protection
        2. 8.5.1.2 Power Dissipation
      2. 8.5.2 Layout Example
  9. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Development Support
        1. 9.1.1.1 Evaluation Module
        2. 9.1.1.2 Spice Models
      2. 9.1.2 Device Nomenclature
    2. 9.2 Documentation Support
      1. 9.2.1 Related Documentation
    3. 9.3 Receiving Notification of Documentation Updates
    4. 9.4 Support Resources
    5. 9.5 Trademarks
    6. 9.6 Electrostatic Discharge Caution
    7. 9.7 Glossary
  10. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.5 Electrical Characteristics

at VIN = VOUT(nom) + 1.5 V; IOUT = 10 mA, COUT = 1.0 μF, and TA = 25°C (unless otherwise noted)
PARAMETERTEST CONDITIONSMINTYPMAXUNIT
VINInput voltage25.5V
VOUTDC output accuracyVOUT > 2 V–1.5%1.5%
1.5 V ≤ VOUT < 2 V–2%2%
1.2 V ≤ VOUT < 1.5 V–4040mV
ΔVOUT(ΔVIN)Line regulationVOUT(nom) + 0.5 V ≤ VIN ≤ 5.5 V, IOUT = 10 mA15mV
ΔVOUT(ΔIOUT)Load regulation0 mA ≤ IOUT ≤ 1 A135mV
VDODropout voltage(1)VIN = 0.98 × VOUT(nom)VOUT < 3.3 VIOUT = 200 mA115mV
IOUT = 500 mA285
IOUT = 800 mA455
IOUT = 1 A570800
VOUT ≥ 3.3 VIOUT = 200 mA90
IOUT = 500 mA230
IOUT = 800 mA365
IOUT = 1 A455700
ICLOutput current limitVOUT = 0.9 × VOUT(nom)1.1A
IQQuiescent currentIOUT = 0 mA50100μA
PSRRPower-supply rejection ratioVIN = 3.3 V, VOUT = 1.8 V,
IOUT = 500 mA, f = 100 Hz		65dB
VnOutput noise voltageBW = 10 Hz to 100 kHz, VIN = 2.8 V, VOUT = 1.8 V,
IOUT = 500 mA		60µVRMS
tSTRStart-up time(2)COUT = 1.0 µF, IOUT = 1 A100µs
UVLOUndervoltage lockoutVIN rising1.95V
TSDThermal shutdown temperatureShutdown, temperature increasing165°C
Reset, temperature decreasing145
TJOperating junction temperature–40125°C
(1) VDO is measured for devices with VOUT(nom) = 2.5 V so that VIN = 2.45 V.
(2) Start-up time = time from when VIN asserts to when output is sustained at a value greater than or equal to 0.98 × VOUT(nom).