SNOSDK2A June 2024 – December 2024 TLV3231-Q1
PRODMIX
- 1
- 1 Features
- 2 Applications
- 3 Description
- 4 Pin Configuration and Functions
- 5 Specifications
- 6 Detailed Description
- 7 Application and Implementation
- 8 Device and Documentation Support
- 9 Revision History
- 10Mechanical, Packaging, and Orderable Information
Package Options
Mechanical Data (Package|Pins)
- DCK|5
Thermal pad, mechanical data (Package|Pins)
Orderable Information
5.8 Typical Characteristics
Figure 5-1 Offset vs. Temperature
Figure 5-3 Offset vs. Common-Mode, 3.3V
Figure 5-5 Offset vs. Common-Mode, 5V
Figure 5-7 Bias Current vs. Common-Mode
Figure 5-9 Output Voltage vs. Output Sourcing Current, 3.3V
Figure 5-11 Output Voltage vs. Output Sourcing Current, 5V
Figure 5-13 Supply Current vs. Supply Voltage (Output Low)
Figure 5-15 Supply Current vs. Temperature (Output Low)
Figure 5-17 Propagation Delay (Low to High) vs. Common-Mode
Figure 5-19 Propagation Delay (Low to High) vs. Overdrive (3.3V)
Figure 5-21 Propagation Delay (Low to High) vs. Overdrive (5V)
Figure 5-23 Propagation Delay (Low to High) vs. Underdrive (3.3V)
Figure 5-25 Propagation Delay (Low to High) vs. Underdrive (5V)
Figure 5-27 Rise and Fall Times vs. Capacitive Loads
Figure 5-2 Hysteresis vs. Temperature
Figure 5-4 Hysteresis vs. Common-Mode, 3.3V
Figure 5-6 Hysteresis vs. Common-Mode, 5V
Figure 5-8 Bias Current vs. Temperature
Figure 5-10 Output Voltage vs. Output Sinking Current, 3.3V
Figure 5-12 Output Voltage vs. Output Sinking Current, 5V
Figure 5-14 Supply Current vs. Supply Voltage (Output High)
Figure 5-16 Supply Current vs. Temperature (Output High)
Figure 5-18 Propagation Delay (High to Low) vs. Common-Mode
Figure 5-20 Propagation Delay (High to Low) vs. Overdrive (3.3V)
Figure 5-22 Propagation Delay (High to Low) vs. Overdrive (5V)
Figure 5-24 Propagation Delay (High to Low) vs. Underdrive (3.3V)
Figure 5-26 Propagation Delay (High to Low) vs. Underdrive (5V)