SLVS139Z July   1996  – June 2024 TLV431 , TLV431A , TLV431B

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics for TLV431
    6. 5.6 Electrical Characteristics for TLV431A
    7. 5.7 Electrical Characteristics for TLV431B
    8. 5.8 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
    4. 7.4 Device Functional Modes
      1. 7.4.1 Open Loop (Comparator)
      2. 7.4.2 Closed Loop
  9. 8 Applications and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Comparator with Integrated Reference (Open Loop)
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Basic Operation
          2. 8.2.1.2.2 Overdrive
          3. 8.2.1.2.3 Output Voltage and Logic Input Level
            1. 8.2.1.2.3.1 Input Resistance
        3. 8.2.1.3 Application Curves
      2. 8.2.2 Shunt Regulator/Reference
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
          1. 8.2.2.2.1 Programming Output/Cathode Voltage
          2. 8.2.2.2.2 Total Accuracy
          3. 8.2.2.2.3 Stability
        3. 8.2.2.3 Application Curve
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DBZ|3
  • DBV|5
  • PK|3
  • DCK|6
  • LP|3
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.4 Thermal Information

THERMAL METRIC (1) TLV431x UNIT
DCK D PK DBV DBZ LP
6 PINS 8 PINS 3 PINS 5 PINS 3 PINS 3 PINS
RθJA Junction-to-ambient thermal resistance 87 97 52 206 206 140 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 259 39 9 131 76 55 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report (SPRA953).