SBOS779D
June 2016 – May 2017
TLV6001
,
TLV6002
,
TLV6004
PRODUCTION DATA.
1
Features
2
Applications
3
Description
4
Revision History
5
Device Comparison Table
6
Pin Configuration and Functions
7
Specifications
7.1
Absolute Maximum Ratings
7.2
ESD Ratings
7.3
Recommended Operating Conditions
7.4
Thermal Information: TLV6001
7.5
Thermal Information: TLV6002
7.6
Thermal Information: TLV6004
7.7
Electrical Characteristics: VS= 1.8 V to 5 V (±0.9 V to ±2.75 V)
7.8
Typical Characteristics: Table of Graphs
7.9
Typical Characteristics
8
Detailed Description
8.1
Overview
8.2
Functional Block Diagram
8.3
Feature Description
8.3.1
Operating Voltage
8.3.2
Rail-to-Rail Input
8.3.3
Rail-to-Rail Output
8.3.4
Common-Mode Rejection Ratio (CMRR)
8.3.5
Capacitive Load and Stability
8.3.6
EMI Susceptibility and Input Filtering
8.4
Device Functional Modes
8.5
Input and ESD Protection
9
Application and Implementation
9.1
Application Information
9.2
Typical Application
9.2.1
Design Requirements
9.2.2
Detailed Design Procedure
9.2.3
Application Curve
9.3
System Examples
10
Power Supply Recommendations
11
Layout
11.1
Layout Guidelines
11.2
Layout Example
12
Device and Documentation Support
12.1
Documentation Support
12.1.1
Related Documentation
12.2
Related Links
12.3
Receiving Notification of Documentation Updates
12.4
Community Resources
12.5
Trademarks
12.6
Electrostatic Discharge Caution
12.7
Glossary
13
Mechanical, Packaging, and Orderable Information
Package Options
Mechanical Data (Package|Pins)
D|8
MSOI002K
DGK|8
MPDS028E
Thermal pad, mechanical data (Package|Pins)
Orderable Information
sbos779d_oa
sbos779d_pm
5
Device Comparison Table
DEVICE
NO. OF
CHANNELS
PACKAGE-LEADS
SC70
SOT-23
SOIC
VSSOP
TSSOP
TLV6001
1
5
5
—
—
—
TLV6002
2
—
—
8
8
—
TLV6004
4
—
—
—
—
14