SNOSDA5D May   2020  – February 2023 TLV7031-Q1 , TLV7032-Q1 , TLV7034-Q1 , TLV7041-Q1 , TLV7042-Q1 , TLV7044-Q1

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions: TLV7032/42
    2. 5.1 Pin Functions: TLV7034/44
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information (Single)
    5. 6.5  Thermal Information (Dual)
    6. 6.6  Thermal Information (Quad)
    7. 6.7  Electrical Characteristics
    8. 6.8  Switching Characteristics
    9. 6.9  Electrical Characteristics (Dual)
    10. 6.10 Switching Characteristics (Dual)
    11. 6.11 Electrical Characteristics (Quad)
    12. 6.12 Switching Characteristics (Quad)
    13. 6.13 Timing Diagrams
    14. 6.14 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
    4. 7.4 Device Functional Modes
      1. 7.4.1 Inputs
      2. 7.4.2 Internal Hysteresis
      3. 7.4.3 Output
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Inverting Comparator With Hysteresis for TLV703x-Q1
      2. 8.1.2 Noninverting Comparator With Hysteresis for TLV703x-Q1
    2. 8.2 Typical Applications
      1. 8.2.1 Window Comparator
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curve
      2. 8.2.2 IR Receiver Analog Front End
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
        3. 8.2.2.3 Application Curve
      3. 8.2.3 Square-Wave Oscillator
        1. 8.2.3.1 Design Requirements
        2. 8.2.3.2 Detailed Design Procedure
        3. 8.2.3.3 Application Curve
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Development Support
        1. 11.1.1.1 Evaluation Module
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.6 Thermal Information (Quad)

THERMAL METRIC (1) TLV7034/44 UNIT
RTE (QFN) PW (TSSOP)
16 PINS 14 PINS
RθJA Junction-to-ambient thermal resistance 65.4 131.0 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 70.2 60.5 °C/W
RθJB Junction-to-board thermal resistance 40.5 74.1 °C/W
ΨJT Junction-to-top characterization parameter 5.6 12.6 °C/W
ΨJB Junction-to-board characterization parameter 40.5 73.5 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 24.1 n/a °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.