SLVSGU2E February 2023 – April 2024 TLV709
PRODUCTION DATA
THERMAL METRIC(1) | TLV709 (2) | UNIT | |||
---|---|---|---|---|---|
DBV [SOT-23] | PK [SOT-89] | AxxPK [SOT-89] | |||
5 PINS | 4 PINS | 4 PINS | |||
RθJA | Junction-to-ambient thermal resistance | 195.7 | 131.7 | 72.5 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 88.2 | 65.8 | 121.4 | °C/W |
RθJB | Junction-to-board thermal resistance | 40.7 | 32.4 | 37.3 | °C/W |
ψJT | Junction-to-top characterization parameter | 11.2 | 69.8 | 29.6 | °C/W |
ψJB | Junction-to-board characterization parameter | 40.5 | 96.2 | 36.8 | °C/W |