SBVS323 September   2017 TLV742P

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagrams
    3. 7.3 Feature Description
      1. 7.3.1 Internal Current Limit
      2. 7.3.2 Shutdown
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Input and Output Capacitor Requirements
        2. 8.2.2.2 Dropout Voltage
        3. 8.2.2.3 Transient Response
      3. 8.2.3 Application Curves
    3. 8.3 Do's and Don'ts
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Board Layout Recommendations to Improve PSRR and Noise Performance
      2. 10.1.2 Package Mounting
    2. 10.2 Layout Example
    3. 10.3 Thermal Considerations
    4. 10.4 Power Dissipation
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Development Support
        1. 11.1.1.1 Evaluation Modules
      2. 11.1.2 Device Nomenclature
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DQN|4
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6 Specifications

6.1 Absolute Maximum Ratings

over operating junction temperature range (unless otherwise noted)(1)
MIN MAX UNIT
Voltage(2) IN –0.3 6 V
EN –0.3 6 V
OUT –0.3 6 V
Current (source) OUT Internally limited
Output short-circuit duration Indefinite
Operating junction, TJ –55 150 °C
Storage, Tstg –55 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods my affect device reliability.
(2) All voltages are with respect to GND pin.

6.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human body model (HBM) QSS 009-105 (JESD22-A114A)(1) ±2000 V
Charged device model (CDM) QSS 009-147 (JESD22-C101B.01)(2) ±500
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating junction temperature range (unless otherwise noted)
MIN NOM MAX UNIT
VIN Input voltage 2 5.5 V
IOUT Output current 0 200 mA
TJ Operating junction temperature range –40 125 °C

6.4 Thermal Information

THERMAL METRIC(1) TLV742P UNIT
DQN (X2SON)
4 PINS
RθJA Junction-to-ambient thermal resistance 180.4 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 152 °C/W
RθJB Junction-to-board thermal resistance 117.2 °C/W
ψJT Junction-to-top characterization parameter 5.1 °C/W
ψJB Junction-to-board characterization parameter 117 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 99.7 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.

6.5 Electrical Characteristics

at VIN = VOUT(NOM) + 0.5 V or 2 V (whichever is greater); IOUT = 1 mA, VEN = VIN, COUT = 0.47 μF, and TJ = –40°C to +85°C. Typical values are at TJ = 25°C, (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
VIN Input voltage range 2 5.5 V
VOUT Output voltage range 0.85 5 V
DC output accuracy 0.5%
VOUT ≥ 0.85 V –1.5% 1.5%
ΔVO(ΔVI) Line regulation 1 5 mV
ΔVO(ΔIO) Load regulation 0 mA ≤ IOUT ≤ 150 mA 10 20 mV
V(DO) Dropout voltage VIN = 0.98 × VOUT(NOM) 2 V < VOUT ≤ 2.4 V IOUT = 30 mA 65 mV
IOUT = 150 mA 325 360 mV
2.4 V < VOUT ≤ 2.8 V IOUT = 30 mA 50 mV
IOUT = 150 mA 250 300 mV
2.8 V < VOUT ≤ 3.3 V IOUT = 30 mA 45 mV
IOUT = 150 mA 220 270 mV
3.3 V < VOUT ≤ 5 V IOUT = 30 mA 40 mV
IOUT = 150 mA 200 250 mV
ICL Output current limit VOUT = 0.9 × VOUT(NOM) 240 300 450 mA
I(GND) Ground pin current IOUT = 0 mA 25 50 µA
I(EN) EN pin current VEN = 5.5 V 0.01 µA
ISHUTDOWN Shutdown current VEN ≤ 0.4 V
2 V ≤ VIN ≤ 4.5 V		 1 µA
VIL(EN) EN pin low-level input voltage
(disable device)		 0 0.4 V
VIH(EN) EN pin high-level input voltage (enable device) 0.9 VIN V
PSRR Power-supply rejection ratio VIN = 3.3 V
VOUT = 2.8 V
IOUT = 30 mA		 f = 100 Hz 70 dB
f = 10 kHz 55
f = 1 MHz 55
Vn Output noise voltage BW = 100 Hz to 100 kHz,
VIN = 2.3 V
VOUT = 1.8 V
IOUT = 10 mA		 45 µVRMS
tSTR Startup time(1) COUT = 1 µF
IOUT = 150 mA		 100 µs
RPULLDOWN Pulldown resistance
(TLV742P only)		 120 Ω
TJ Operating junction temperature –40 125 °C
(1) Start-up time = time from EN assertion to 0.98 × VOUT.

6.6 Typical Characteristics

at TJ = –40°C to +85°C, VIN = VOUT(NOM) + 0.5 V or 2 V (whichever is greater), IOUT = 10 mA, VEN = VIN, and COUT = 1 µF Typical values are at TJ = 25°C, (unless otherwise noted)
TLV742P tc_load_reg_12v_bvs244.gif
VOUT = 1.2 V
Figure 1. Load Regulation
TLV742P tc_line_reg_10ma_12v_bvs244.gif
VOUT = 1.2 V, IOUT = 10 mA
Figure 3. Line Regulation
TLV742P tc_line_reg_150ma_12v_bvs244.gif
VOUT = 1.2 V, IOUT = 150 mA
Figure 5. Line Regulation
TLV742P tc_vout-tmp_12v_bvs153.gif
VOUT = 1.2 V
Figure 7. Output Voltage vs Temperature
TLV742P tc_vdo-vin_150ma_bvs244.gif
IOUT = 150 mA
Figure 9. Dropout Voltage vs Input Voltage
TLV742P tc_vdo-iout_28v_bvs153.gif
VOUT = 2.8 V
Figure 11. Dropout Voltage vs Output Current
TLV742P tc_ignd-vin_28v_bvs244.gif
VOUT = 2.8 V, IOUT = 0 mA
Figure 13. Ground Pin Current vs Input Voltage
TLV742P tc_ignd-tmp_28v_bvs244.gif
VOUT = 2.8 V, IOUT = 0 mA
Figure 15. Ground Pin Current vs Temperature
TLV742P tc_ignd-iout_28v_bvs244.gif
VOUT = 2.8 V
Figure 17. Ground Pin Current vs Output Current
TLV742P tc_ishdn-vin_28v_bvs244.gif
VOUT = 2.8 V
Figure 19. Shutdown Current vs Input Voltage
TLV742P tc_ilim-vin_28v_bvs244.gif
VOUT = 2.8 V
Figure 21. Current Limit vs Input Voltage
TLV742P tc_psrr-frq_28v_bvs153.gif
VOUT = 2.8 V
Figure 23. Power-Supply Ripple Rejection vs Frequency
TLV742P tc_psrr-vin_28v_150ma_bvs244.gif
VOUT = 2.8 V, IOUT = 150 mA
Figure 25. Power-Supply Ripple Rejection vs Input Voltage
TLV742P tc_psrr-vin_33v_150ma_bvs244.gif
VOUT = 3.3 V, IOUT = 150 mA
Figure 27. Power-Supply Ripple Rejection vs Input Voltage
TLV742P tc_load_12v_50-150_bvs153.gif
VOUT = 1.2 V
Figure 29. Load Transient Response
TLV742P tc_load_28v_50-100_bvs153.gif
VOUT = 2.8 V
Figure 31. Load Transient Response
TLV742P tc_line_12v_150ma_A_bvs153.gif
VOUT = 1.2 V, IOUT = 150 mA
Figure 33. Line Transient Response
TLV742P tc_line_12v_150ma_B_bvs153.gif
VOUT = 1.2 V, IOUT = 150 mA
Figure 35. Line Transient Response
TLV742P tc_line_28v_150ma_A_bvs153.gif
VOUT = 2.8 V, IOUT = 150 mA
Figure 37. Line Transient Response
TLV742P tc_line_28v_150ma_B_bvs153.gif
VOUT = 2.8 V, IOUT = 200 mA
Figure 39. Line Transient Response
TLV742P tc_ramp_up_down_bvs153.gif
VOUT = 1.2 V, IOUT = 30 mA
Figure 41. VIN Ramp Up, Ramp Down Response
TLV742P tc_load_reg_28v_bvs244.gif
VOUT = 2.8 V
Figure 2. Load Regulation
TLV742P tc_line_reg_10ma_28v_bvs244.gif
VOUT = 2.8 V, IOUT = 10 mA
Figure 4. Line Regulation
TLV742P tc_line_reg_150ma_28v_bvs244.gif
VOUT = 2.8 V, IOUT = 150 mA
Figure 6. Line Regulation
TLV742P tc_vout-tmp_28v_bvs153.gif
VOUT = 2.8 V
Figure 8. Output Voltage vs Temperature
TLV742P tc_vdo-vin_200ma_bvs244.gif
IOUT = 200 mA
Figure 10. Dropout Voltage vs Input Voltage
TLV742P tc_ignd-vin_12v_bvs244.gif
VOUT = 1.2 V, IOUT = 0 mA
Figure 12. Ground Pin Current vs Input Voltage
TLV742P tc_ignd-tmp_12v_bvs244.gif
VOUT = 1.2 V, IOUT = 0 mA
Figure 14. Ground Pin Current vs Temperature
TLV742P tc_ignd-iout_12v_bvs244.gif
VOUT = 1.2 V
Figure 16. Ground Pin Current vs Output Current
TLV742P tc_ishdn-vin_12v_bvs244.gif
VOUT = 1.2 V
Figure 18. Shutdown Current vs Input Voltage
TLV742P tc_ilim-vin_12v_bvs244.gif
VOUT = 1.2 V
Figure 20. Current Limit vs Input Voltage
TLV742P tc_psrr-frq_12v_bvs153.gif
VOUT = 1.2 V
Figure 22. Power-Supply Ripple Rejection vs Frequency
TLV742P tc_psrr-vin_28v_30ma_bvs244.gif
VOUT = 2.8 V, IOUT = 30 mA
Figure 24. Power-Supply Ripple Rejection vs Input Voltage
TLV742P tc_psrr-vin_33v_30ma_bvs244.gif
VOUT = 3.3 V, IOUT = 30 mA
Figure 26. Power-Supply Ripple Rejection vs Input Voltage
TLV742P tc_noise-frq_bvs244.gif
Figure 28. Output Spectral Noise Density vs Frequency
TLV742P tc_load_12v_1-150_bvs153.gif
VOUT = 1.2 V
Figure 30. Load Transient Response
TLV742P tc_load_28v_1-150_bvs153.gif
VOUT = 2.8 V
Figure 32. Load Transient Response
TLV742P tc_line_12v_200ma_A_bvs153.gif
VOUT = 1.2 V, IOUT = 200 mA
Figure 34. Line Transient Response
TLV742P tc_line_12v_200ma_B_bvs153.gif
VOUT = 1.2 V, IOUT = 200 mA
Figure 36. Line Transient Response
TLV742P tc_line_28v_200ma_A_bvs153.gif
VOUT = 2.8 V, IOUT = 200 mA
Figure 38. Line Transient Response
TLV742P tc_line_28v_200ma_B_bvs244.gif
VOUT = 2.8 V, IOUT = 200 mA
Figure 40. Line Transient Response
TLV742P tc_ramp_28v_bvs153.gif
VOUT = 2.8 V, IOUT = 30 mA
Figure 42. VIN Ramp Up, Ramp Down Response