Refer to the PDF data sheet for device specific package drawings
The TLV743P low-dropout linear regulator (LDO) is an ultra-small, low quiescent current LDO that sources 300 mA with good line and load transient performance. The device provides a typical accuracy of 1%.
The TLV743P is designed to be stable with a small output capacitor with a value of 1 µF. The TLV743P device provides foldback current control during device power up and enabling. This functionality is especially important in battery-operated devices.
The TLV743P provides an active pulldown circuit to quickly discharge output loads when the device is disabled.
The TLV743P is available in standard DBV (SOT-23) and DQN (X2SON) packages.
PART NUMBER | PACKAGE | BODY SIZE (NOM) |
---|---|---|
TLV743P | SOT-23 (5) | 2.90 mm × 1.60 mm |
X2SON (4) | 1.00 mm × 1.00 mm |
Changes from B Revision (March 2018) to C Revision
Changes from A Revision (January 2018) to B Revision
Changes from * Revision (July 2017) to A Revision
PIN | I/O | DESCRIPTION | ||
---|---|---|---|---|
NAME | SOT-23 | X2SON | ||
EN | 3 | 3 | I | Enable pin. Drive EN greater than VEN(LO) to turn on the regulator.
Drive EN less than VEN(LO) to put the LDO into shutdown mode. |
GND | 2 | 2 | — | Ground pin |
IN | 1 | 4 | I | Input pin. A small capacitor is recommended from this pin to ground.
See Input and Output Capacitor Selection for more details. |
NC | 4 | — | No internal connection | |
OUT | 5 | 1 | O | Regulated output voltage pin. For best transient response, use a small 1-μF ceramic capacitor from this pin to ground.
See Input and Output Capacitor Selection for more details. |
Thermal pad | — | Thermal pad | — | The thermal pad is electrically connected to the GND node.
Connect to the GND plane for improved thermal performance. |