SBVS322C October   2017  – March 2024 TLV757P

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Undervoltage Lockout (UVLO)
      2. 6.3.2 Enable (EN)
      3. 6.3.3 Internal Foldback Current Limit
      4. 6.3.4 Thermal Shutdown
    4. 6.4 Device Functional Modes
      1. 6.4.1 Normal Operation
      2. 6.4.2 Dropout Operation
      3. 6.4.3 Disabled
  8. 7 Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Input and Output Capacitor Selection
      2. 7.1.2 Dropout Voltage
      3. 7.1.3 Exiting Dropout
      4. 7.1.4 Reverse Current
      5. 7.1.5 Power Dissipation (PD)
        1. 7.1.5.1 Estimating Junction Temperature
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
        1. 7.2.2.1 Input Current
        2. 7.2.2.2 Thermal Dissipation
      3. 7.2.3 Application Curves
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Examples
  9. 8 Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Device Nomenclature
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DYD|5
  • DBV|5
  • DRV|6
Thermal pad, mechanical data (Package|Pins)
Orderable Information

3 Description

The TLV757P low-dropout regulator (LDO) is an ultra-small, low quiescent current LDO that sources 1A with good line and load transient performance. The TLV757P is optimized for a wide variety of applications by supporting an input voltage range from 1.45V to 5.5V. To minimize cost and solution size, the device is offered in fixed output voltages ranging from 0.6V to 5V. This range supports the lower core voltages of modern microcontrollers (MCUs). Additionally, the TLV757P has a low IQ with enable functionality to minimize standby power. This device features an internal soft-start to lower the inrush current. This feature provides a controlled voltage to the load and minimizes the input voltage drop during start-up. When shutdown, the device actively pulls down the output to quickly discharge the outputs and provides a known start-up state.

The TLV757P is stable with small ceramic output capacitors allowing for a small overall solution size. A precision band-gap and error amplifier provides a typical accuracy of 1%. All device versions have integrated thermal shutdown, current limit, and undervoltage lockout (UVLO). The TLV757P has an internal foldback current limit that helps reduce thermal dissipation during short-circuit events.

The TLV757 is available in the popular SON and SOT23-5 packages. This device is also available in a thermally enhanced SOT23-5 package (DYD) with a thermal pad. This package provides significantly reduced thermal resistance compared to a standard SOT23-5 package.

Package Information
PART NUMBERPACKAGE(1)PACKAGE SIZE(2)
TLV757PDRV (WSON, 6)2mm × 2mm
DBV (SOT-23, 5)2.9mm × 2.8mm
DYD (SOT-23, 5)2.9mm × 1.6mm
(1) For more information, see the Mechanical, Packaging, and Orderable Information.
(2) The package size (length × width) is a nominal value and includes pins, where applicable.