SBVS322C October   2017  – March 2024 TLV757P

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Undervoltage Lockout (UVLO)
      2. 6.3.2 Enable (EN)
      3. 6.3.3 Internal Foldback Current Limit
      4. 6.3.4 Thermal Shutdown
    4. 6.4 Device Functional Modes
      1. 6.4.1 Normal Operation
      2. 6.4.2 Dropout Operation
      3. 6.4.3 Disabled
  8. 7 Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Input and Output Capacitor Selection
      2. 7.1.2 Dropout Voltage
      3. 7.1.3 Exiting Dropout
      4. 7.1.4 Reverse Current
      5. 7.1.5 Power Dissipation (PD)
        1. 7.1.5.1 Estimating Junction Temperature
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
        1. 7.2.2.1 Input Current
        2. 7.2.2.2 Thermal Dissipation
      3. 7.2.3 Application Curves
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Examples
  9. 8 Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Device Nomenclature
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DYD|5
  • DBV|5
  • DRV|6
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.5 Electrical Characteristics

over operating free-air temperature range (TJ = –40°C to +125°C), VIN = VOUT + 0.5 V or 1.45 V (whichever is greater), IOUT = 1 mA, VEN = VIN, and CIN = COUT = 1 µF (unless otherwise noted); all typical values are at TJ = 25°C.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
VIN Input voltage 1.45 5.5 V
VOUT Output voltage 0.6 5.0 V
Output accuracy –40°C ≤ TJ ≤ 85°C, VOUT ≥ 1V –1 1 %
–40°C ≤ TJ ≤ 85°C, 0.6V ≤ VOUT < 1V –10 10 mV
VOUT ≥ 1V –1.5 1.5 %
0.6V ≤ VOUT < 1V –15 15 mV
(ΔVOUT)ΔVIN Line regulation VOUT + 0.5V(1) ≤ VIN ≤ 5.5V 2 mV
ΔVOUT/ΔIOUT Load regulation 0.1mA ≤ IOUT ≤ 1A, VIN ≥ 2.4V DRV package 0.044 V/A
DBV package 0.060
ΔVOUT/ΔIOUT Load regulation 0.1 mA ≤ IOUT ≤ 1A, VIN ≥ 2.4V DYD package 0.069 V/A
IGND Ground current TJ = 25°C 25 31 µA
–40°C ≤ TJ ≤ +85°C 33
–40°C ≤ TJ ≤ +125°C 40
ISHDN Shutdown current VEN ≤ 0.4V, 1.45V ≤ VIN ≤ 5.5V 0.1 1 µA
ICL Output current limit VIN = VOUT + VDO(MAX) + 0.25V VOUT = VOUT - 0.2V, VOUT ≤ 1.5V 1.2 1.55 1.78 A
VOUT = 0.9 x VOUT,
1.5V < VOUT ≤ 4.5V
ISC Short circuit current limit VOUT = 0V, VIN = VOUT + VDO(MAX) + 0.25V 755 mA
VDO Dropout voltage IOUT = 1A,
–40°C ≤ TJ ≤ +85°C		 0.6V ≤ VOUT < 0.8V 1350 1400 mV
0.8V ≤ VOUT < 1V 1200 1300
0.8V ≤ VOUT < 1V, DYD package 1225 1325
1V ≤ VOUT < 1.2V 1100 1150
1V ≤ VOUT < 1.2V, DYD package 1125 1175
1.2V ≤ VOUT < 1.5V 1000 1050
1.2V ≤ VOUT < 1.5V, DYD package 1025 1075
1.5V ≤ VOUT < 1.8V 700 800
1.5V ≤ VOUT < 1.8V, DYD package 725 825
1.8V ≤ VOUT < 2.5V 650 750
1.8V ≤ VOUT < 2.5V, DYD package 650 775
2.5V ≤ VOUT < 3.3V 500 600
2.5V ≤ VOUT < 3.3V, DYD package 525 625
3.3V ≤ VOUT < 5.0V 300 425
3.3V ≤ VOUT < 5.0V, DYD package 300 450
IOUT = 1A,
–40°C ≤ TJ ≤ +125°C		 0.6V ≤ VOUT < 0.8V 1450
0.8V ≤ VOUT < 1V 1350
0.8V ≤ VOUT < 1V, DYD package 1375
1V ≤ VOUT < 1.2V 1200
1V ≤ VOUT < 1.2V, DYD package 1225
1.2V ≤ VOUT < 1.5V 1100
1.2V ≤ VOUT < 1.5V, DYD package 1125
1.5V ≤ VOUT < 1.8V 850
1.5V ≤ VOUT < 1.8V, DYD package 875
1.8V ≤ VOUT < 2.5V 800
1.8V ≤ VOUT < 2.5V, DYD package 825
2.5V ≤ VOUT < 3.3V 650
2.5V ≤ VOUT < 3.3V, DYD package 675
3.3V ≤ VOUT < 5.0V 475
3.3V ≤ VOUT < 5.0V, DYD package 500
PSRR Power supply rejection ratio f = 1kHz, VIN = VOUT + 1V, IOUT = 50mA 52 dB
f = 100kHz, , VIN = VOUT + 1 V, IOUT = 50mA 46
f = 1MHz, , VIN = VOUT + 1V, IOUT = 50mA 52
Vn Output noise voltage BW = 10Hz to 100kHz, VOUT = 1.2V, IOUT = 1A 71.5 µVRMS
VUVLO Undervoltage lockout VIN rising 1.21 1.3 1.44 V
VUVLO, HYST Undervoltage lockout hysteresis VIN falling 40 mV
tSTR Startup time 550 µs
VHI EN pin high voltage (enabled) 1 V
VLO EN pin low voltage (enabled) 0.3 V
IEN Enable pin current VIN = 5.5V, EN = 5.5V 10 nA
RPULLDOWN Pulldown resistance VIN = 3.3V (P version only) 95 Ω
TSD Thermal shutdown Shutdown, temperature increasing 165 °C
Reset, temperature decreasing 155 °C
(1) VIN = 1.45V for VOUT < 0.9V