SBVS456 September   2024 TLV774

ADVANCE INFORMATION  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Pin Configuration and Functions
  6. Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Switching Characteristics
  7. Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Dropout Voltage
      2. 6.3.2 Active Discharge
      3. 6.3.3 Foldback Current Limit
      4. 6.3.4 Thermal Shutdown
    4. 6.4 Device Functional Modes
      1. 6.4.1 Normal Operation
      2. 6.4.2 Dropout Operation
      3. 6.4.3 Disabled
  8. Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Recommended Capacitor Types
      2. 7.1.2 Input and Output Capacitor Requirements
    2. 7.2 Typical Application
      1. 7.2.1 Application
      2. 7.2.2 Design Requirements
      3. 7.2.3 Detailed Design Procedure
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Device Nomenclature
    2. 8.2 Documentation Support
      1. 8.2.1 Related Documentation
    3. 8.3 Receiving Notification of Documentation Updates
    4. 8.4 Support Resources
    5. 8.5 Trademarks
    6. 8.6 Electrostatic Discharge Caution
    7. 8.7 Glossary
  10. Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Pin Configuration and Functions

TLV774 DQN
                            Package,1mm × 1mm, 4-Pin
                            X2SON(Top View)Figure 4-1 DQN Package,1mm × 1mm, 4-Pin X2SON(Top View)
Table 4-1 Pin Functions
NAME X2SON TYPE(1) DESCRIPTION
EN 3 I Enable input. A low voltage (< VEN(LOW)) on this pin turns the regulator off and discharges the output pin to GND. A high voltage (> VEN(HI)) on this pin enables the regulator output.
GND 2 G Common ground.
IN 4 I Input voltage supply. For best transient response and to minimize input impedance, use the nominal value or larger capacitor from IN to ground. See the Recommended Operating Conditions table. Place the input capacitor as close to the IN and GND pins of the device as possible.
OUT 1 O Regulated output voltage. A low equivalent series resistance (ESR) capacitor is required from OUT to ground for stability. For best transient response, use the nominal recommended value or larger capacitor listed in the Recommended Operating Conditions table. Place the output capacitor as close to the OUT and GND pins of the device as possible. An internal pulldown resistor prevents a charge from remaining on VOUT when the regulator is in shutdown mode (VEN< VEN(LOW)).
Thermal Pad 5 Thermal pad for the X2SON package. Connect this pad to GND or leave floating.
Do not connect to any potential other than GND. Connect the thermal pad to a large-area ground plane for best thermal performance.
I = input, O = output, I/O = input or output, and G = ground.