SBVS456 September   2024 TLV774

ADVANCE INFORMATION  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Switching Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Dropout Voltage
      2. 6.3.2 Active Discharge
      3. 6.3.3 Foldback Current Limit
      4. 6.3.4 Thermal Shutdown
    4. 6.4 Device Functional Modes
      1. 6.4.1 Normal Operation
      2. 6.4.2 Dropout Operation
      3. 6.4.3 Disabled
  8. 7 Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Recommended Capacitor Types
      2. 7.1.2 Input and Output Capacitor Requirements
    2. 7.2 Typical Application
      1. 7.2.1 Application
      2. 7.2.2 Design Requirements
      3. 7.2.3 Detailed Design Procedure
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Device Nomenclature
    2. 8.2 Documentation Support
      1. 8.2.1 Related Documentation
    3. 8.3 Receiving Notification of Documentation Updates
    4. 8.4 Support Resources
    5. 8.5 Trademarks
    6. 8.6 Electrostatic Discharge Caution
    7. 8.7 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.5 Electrical Characteristics

specifications apply for TJ = 25℃, VIN = VOUT(NOM) + 0.5 V or 1.4 V, whichever is greater, VEN = VIN, IOUT = 1 mA, CIN = 1 µF, and COUT = 1 µF (unless otherwise noted); all typical values are at TJ = 25℃
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
ΔVOUT Output voltage tolerance 0.6V ≤ VOUT < 1.8V –2.5 2.5 %
1.8V ≤ VOUT ≤ 3.3V –2 2
TJ = –40℃ to 85℃ 0.6V ≤ VOUT < 1.2V –3.33 3.33
1.2V ≤ VOUT < 1.8V –3 3
1.8V ≤ VOUT < 2.5V –2.75 2.75
2.5V ≤ VOUT ≤ 3.3V –2.5 2.5
ΔVOUT / ΔVIN Line regulation VIN = (VOUT(NOM) + 0.5V) to 5.5V 0.01 0.1 %/V
ΔVOUT / ΔIOUT Load regulation IOUT = 1mA to 300mA 85 110 µV/mA
IGND Quiescent ground current IOUT = 0mA, TJ = –40°C to 85°C VEN = VIN = 1.6V 76 µA
VEN = VIN = 4V 89
VEN = VIN = 5.5V 98 131
ISHDN Shutdown ground current VEN < VEN(LOW), VIN = 5.5V, TJ = –40°C to 85°C 0.01 2 µA
VDO
Dropout voltage
 
IOUT = 300mA,
VIN = VOUT(NOM)		 1.2V ≤ VOUT < 1.8V(1)(2) 310 mV
1.8V ≤ VOUT < 2.5V 175
2.5V ≤ VOUT < 2.8V 130
2.8V ≤ VOUT ≤ 3.3V 100 135
IOUT = 300mA,
VIN = VOUT(NOM),  
TJ = –40°C to 85°C		 1.2V ≤ VOUT < 1.8V(1)(2) 350
1.8V ≤ VOUT < 2.5V 200
2.5V ≤ VOUT < 2.8V 150
2.8V ≤ VOUT ≤ 3.3V 165
ICL Output current limit VOUT = 0.9 x VOUT(NOM), TJ = –40°C to 85°C 350 800 mA
ISC Short-circuit current limit VOUT = 0V 73 mA
PSRR Power-supply rejection ratio IOUT = 150mA,
VIN = VOUT + 1.0V		 f = 1kHz 60 dB
f = 100kHz 56
f = 1MHz 45
VN Output noise voltage BW = 10Hz to 100kHz, IOUT = 50mA 75 x Vout µVRMS
RPULLDOWN Output automatic discharge pulldown resistance VEN < VEN(LOW) (output disabled), VIN = 3.3V 135 Ω
TSD Thermal shutdown TJ rising 160 °C
TJ falling 140
VEN(LOW)  Low input threshold VEN falling until the output is disabled, TJ = –40°C to 85°C 0.3 V
VEN(HI)  High input threshold VEN rising until the output is enabled, TJ = –40°C to 85°C 0.9 V
IEN EN input leakage current VEN = 5.5V and VIN = 5.5V 0.01 1 µA
(1) For VOUT < 1.4V, dropout is tested with VIN = 1.4V.
(2) For VOUT = 0.6V, Dropout voltage < headroom voltage. At VIN = 1.4V, a 0.6V output device is not in dropout. Headroom voltage = VIN - VOUT.