SBOS839K March   2017  – July 2024 TLV9061 , TLV9062 , TLV9064

PRODMIX  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5.   Device Comparison Table
  6. 4 Pin Configuration and Functions
  7. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information: TLV9061
    5. 5.5  Thermal Information: TLV9061S
    6. 5.6  Thermal Information: TLV9062
    7. 5.7  Thermal Information: TLV9062S
    8. 5.8  Thermal Information: TLV9064
    9. 5.9  Thermal Information: TLV9064S
    10. 5.10 Electrical Characteristics
    11. 5.11 Typical Characteristics
  8. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Rail-to-Rail Input
      2. 6.3.2 Rail-to-Rail Output
      3. 6.3.3 EMI Rejection
      4. 6.3.4 Overload Recovery
      5. 6.3.5 Shutdown Function
    4. 6.4 Device Functional Modes
  9. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Applications
      1. 7.2.1 Typical Low-Side Current Sense Application
      2. 7.2.2 Design Requirements
      3. 7.2.3 Detailed Design Procedure
      4. 7.2.4 Application Curve
    3. 7.3 Power Supply Recommendations
      1. 7.3.1 Input and ESD Protection
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  10. 8 Device and Documentation Support
    1. 8.1 Documentation Support
      1. 8.1.1 Related Documentation
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  11. 9 Revision History
  12. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.9 Thermal Information: TLV9064S

THERMAL METRIC(1)TLV9064SUNIT
RTE (WQFN)
16 PINS
RθJAJunction-to-ambient thermal resistance65.1°C/W
RθJC(top)Junction-to-case(top) thermal resistance67.9°C/W
RθJBJunction-to-board thermal resistance40.4°C/W
ψJTJunction-to-top characterization parameter5.5°C/W
ψJBJunction-to-board characterization parameter40.2°C/W
RθJC(bot)Junction-to-case(bottom) thermal resistance23.8°C/W
(1) For more information about traditional and new thermal metrics, see Semiconductor and IC Package Thermal Metrics.