SBOS839K March 2017 – July 2024 TLV9061 , TLV9062 , TLV9064
PRODMIX
THERMAL METRIC(1) | TLV9061S | UNIT | ||
---|---|---|---|---|
DBV (SOT-23) | DRY (USON) | |||
6 PINS | 6 PINS | |||
RθJA | Junction-to-ambient thermal resistance | 216.5 | TBD | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 155.1 | TBD | °C/W |
RθJB | Junction-to-board thermal resistance | 96.2 | TBD | °C/W |
ψJT | Junction-to-top characterization parameter | 80.3 | TBD | °C/W |
ψJB | Junction-to-board characterization parameter | 95.9 | TBD | °C/W |
RθJC(bot) | Junction-to-case (bottom) thermal resistance | N/A | N/A | °C/W |