SBOSA34E
January 2021 – March 2024
TLV9351-Q1
,
TLV9352-Q1
,
TLV9354-Q1
PRODUCTION DATA
1
1
Features
2
Applications
3
Description
4
Pin Configuration and Functions
5
Specifications
5.1
Absolute Maximum Ratings
5.2
ESD Ratings
5.3
Recommended Operating Conditions
5.4
Thermal Information for Single Channel
5.5
Thermal Information for Dual Channel
5.6
Thermal Information for Quad Channel
5.7
Electrical Characteristics
5.8
Typical Characteristics
6
Detailed Description
6.1
Overview
6.2
Functional Block Diagram
6.3
Feature Description
6.3.1
Input Protection Circuitry
6.3.2
EMI Rejection
6.3.3
Phase Reversal Protection
6.3.4
Thermal Protection
6.3.5
Capacitive Load and Stability
6.3.6
Common-Mode Voltage Range
6.3.7
Electrical Overstress
6.3.8
Overload Recovery
6.3.9
Typical Specifications and Distributions
6.4
Device Functional Modes
7
Application and Implementation
7.1
Application Information
7.2
Typical Applications
7.2.1
High Voltage Precision Comparator
7.2.1.1
Design Requirements
7.2.1.2
Detailed Design Procedure
7.2.1.3
Application Curve
7.3
Power Supply Recommendations
7.4
Layout
7.4.1
Layout Guidelines
7.4.2
Layout Example
8
Device and Documentation Support
8.1
Device Support
8.1.1
Development Support
8.1.1.1
TINA-TI (Free Software Download)
8.1.1.2
TI Precision Designs
8.2
Documentation Support
8.2.1
Related Documentation
8.3
Receiving Notification of Documentation Updates
8.4
Support Resources
8.5
Trademarks
8.6
Electrostatic Discharge Caution
8.7
Glossary
9
Revision History
10
Mechanical, Packaging, and Orderable Information
Package Options
Mechanical Data (Package|Pins)
DCK|5
MPDS025J
DBV|5
MPDS018T
Thermal pad, mechanical data (Package|Pins)
Orderable Information
sbosa34e_oa
sbosa34e_pm
7.4.2
Layout Example
Figure 7-3
Schematic Representation
Figure 7-4
Operational Amplifier Board Layout for Noninverting Configuration
Figure 7-5
Example Layout for SC70 (DCK) Package
Figure 7-6
Example Layout for VSSOP-8 (DGK) Package