SBOSA34E January   2021  – March 2024 TLV9351-Q1 , TLV9352-Q1 , TLV9354-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information for Single Channel
    5. 5.5 Thermal Information for Dual Channel
    6. 5.6 Thermal Information for Quad Channel
    7. 5.7 Electrical Characteristics
    8. 5.8 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Input Protection Circuitry
      2. 6.3.2 EMI Rejection
      3. 6.3.3 Phase Reversal Protection
      4. 6.3.4 Thermal Protection
      5. 6.3.5 Capacitive Load and Stability
      6. 6.3.6 Common-Mode Voltage Range
      7. 6.3.7 Electrical Overstress
      8. 6.3.8 Overload Recovery
      9. 6.3.9 Typical Specifications and Distributions
    4. 6.4 Device Functional Modes
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Applications
      1. 7.2.1 High Voltage Precision Comparator
        1. 7.2.1.1 Design Requirements
        2. 7.2.1.2 Detailed Design Procedure
        3. 7.2.1.3 Application Curve
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Development Support
        1. 8.1.1.1 TINA-TI (Free Software Download)
        2. 8.1.1.2 TI Precision Designs
    2. 8.2 Documentation Support
      1. 8.2.1 Related Documentation
    3. 8.3 Receiving Notification of Documentation Updates
    4. 8.4 Support Resources
    5. 8.5 Trademarks
    6. 8.6 Electrostatic Discharge Caution
    7. 8.7 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9 Revision History

Changes from Revision D (June 2023) to Revision E (March 2024)

  • Added the 5-pin SC70 (DCK) package throughout data sheetGo
  • Added pinout configuration for 5-pin SC70 (DCK) package to Pin Configuration and Functions sectionGo

Changes from Revision C (September 2021) to Revision D (June 2023)

  • Add the 8-pin TSSOP (PW) package throughout data sheetGo

Changes from Revision B (May 2021) to Revision C (September 2021)

  • Deleted preview note from SOIC (14) package throughout data sheet. Go
  • Deleted preview note from SOT-23 (14) package throughout data sheet. Go
  • Deleted preview note from SOIC (8) package throughout data sheet. Go
  • Deleted preview note from SOT-23 (5) package throughout data sheet. Go

Changes from Revision A (March 2021) to Revision B (May 2021)

  • Deleted preview note from TSSOP (14) package throughout data sheet. Go
  • Deleted preview note from PW package in Thermal Information for Quad Channel tableGo

Changes from Revision * (January 2021) to Revision A (March 2021)

  • Changed device status from Advance Information to Production Data Go
  • Deleted preview note from VSSOP (8) package throughout data sheetGo