SBOSAD6B
April 2023 – August 2024
TLV9361-Q1
,
TLV9362-Q1
,
TLV9364-Q1
PRODUCTION DATA
1
1
Features
2
Applications
3
Description
4
Pin Configuration and Functions
5
Specifications
5.1
Absolute Maximum Ratings
5.2
ESD Ratings
5.3
Recommended Operating Conditions
5.4
Thermal Information for Single Channel
5.5
Thermal Information for Dual Channel
5.6
Thermal Information for Quad Channel
5.7
Electrical Characteristics
5.8
Typical Characteristics
6
Detailed Description
6.1
Overview
6.2
Functional Block Diagram
6.3
Feature Description
6.3.1
EMI Rejection
6.3.2
Thermal Protection
6.3.3
Capacitive Load and Stability
6.3.4
Electrical Overstress
6.3.5
Overload Recovery
6.3.6
Typical Specifications and Distributions
6.4
Device Functional Modes
7
Application and Implementation
7.1
Application Information
7.2
Typical Applications
7.2.1
Low-Side Current Measurement
7.2.2
Design Requirements
7.2.3
Detailed Design Procedure
7.2.4
Application Curves
7.3
Power Supply Recommendations
7.4
Layout
7.4.1
Layout Guidelines
7.4.2
Layout Example
8
Device and Documentation Support
8.1
Device Support
8.1.1
Development Support
8.1.1.1
TINA-TI (Free Software Download)
8.1.1.2
TI Precision Designs
8.2
Documentation Support
8.2.1
Related Documentation
8.3
Receiving Notification of Documentation Updates
8.4
Support Resources
8.5
Trademarks
8.6
Electrostatic Discharge Caution
8.7
Glossary
9
Revision History
10
Mechanical, Packaging, and Orderable Information
Package Options
Mechanical Data (Package|Pins)
D|8
MSOI002K
PW|8
MPDS568
DGK|8
MPDS028E
Thermal pad, mechanical data (Package|Pins)
Orderable Information
sbosad6b_oa
sbosad6b_pm
7.2.4
Application Curves
Figure 7-2
Low-Side, Current-Sense, Transfer Function