SBOSAD6B April   2023  – August 2024 TLV9361-Q1 , TLV9362-Q1 , TLV9364-Q1

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Pin Configuration and Functions
  6. Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information for Single Channel
    5. 5.5 Thermal Information for Dual Channel
    6. 5.6 Thermal Information for Quad Channel
    7. 5.7 Electrical Characteristics
    8. 5.8 Typical Characteristics
  7. Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 EMI Rejection
      2. 6.3.2 Thermal Protection
      3. 6.3.3 Capacitive Load and Stability
      4. 6.3.4 Electrical Overstress
      5. 6.3.5 Overload Recovery
      6. 6.3.6 Typical Specifications and Distributions
    4. 6.4 Device Functional Modes
  8. Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Applications
      1. 7.2.1 Low-Side Current Measurement
      2. 7.2.2 Design Requirements
      3. 7.2.3 Detailed Design Procedure
      4. 7.2.4 Application Curves
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Development Support
        1. 8.1.1.1 TINA-TI (Free Software Download)
        2. 8.1.1.2 TI Precision Designs
    2. 8.2 Documentation Support
      1. 8.2.1 Related Documentation
    3. 8.3 Receiving Notification of Documentation Updates
    4. 8.4 Support Resources
    5. 8.5 Trademarks
    6. 8.6 Electrostatic Discharge Caution
    7. 8.7 Glossary
  10. Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Description

The TLV936x-Q1 family (TLV9361-Q1, TLV9362-Q1, and TLV9364-Q1) is a family of AEC-Q100 automotive qualified, 40V cost-optimized operational amplifiers.

These devices offer strong DC and AC specifications, including rail-to-rail output, low input voltage noise density (6 nV/√Hz), low offset (±400µV, typical), low offset drift (±1.25µV/°C, typical), and 10.6MHz bandwidth.

Features such as EMIRR filtering, high output current (±60mA), and high slew rate (25V/µs) make the TLV936x-Q1 a robust operational amplifier for high-voltage, cost-sensitive applications.

The TLV936x-Q1 family of op amps is available in standard packages and is specified from –40°C to 125°C.

Package Information
PART NUMBER(1) PACKAGE PACKAGE SIZE(2)
TLV9361-Q1 DBV (SOT-23, 5) 2.9mm × 2.8mm
DCK (SC70, 5) 2mm × 2.1mm
TLV9362-Q1 D (SOIC, 8) 4.9mm × 6mm
DGK (VSSOP, 8) 3mm × 4.9mm
PW (TSSOP, 8) 3mm × 6.4mm
TLV9364-Q1 D (SOIC, 14) 8.65mm × 6mm
PW (TSSOP, 14) 5mm × 6.4mm
For all available packages, see the orderable addendum at the end of the data sheet.
The package size (length × width) is a nominal value and includes pins, where applicable.
TLV9361-Q1 TLV9362-Q1 TLV9364-Q1 TLV936x-Q1 in a
                                                Single-Pole, Low-Pass Filter TLV936x-Q1 in a Single-Pole, Low-Pass Filter