SNVSCI2B February   2023  – February 2024 TLVM23615 , TLVM23625

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 System Characteristics
    7. 6.7 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Input Voltage Range
      2. 7.3.2  Output Voltage Selection
      3. 7.3.3  Input Capacitors
      4. 7.3.4  Output Capacitors
      5. 7.3.5  Enable, Start-Up, and Shutdown
      6. 7.3.6  Switching Frequency (RT)
      7. 7.3.7  Power-Good Output Operation
      8. 7.3.8  Internal LDO, VCC and VOUT/FB Input
      9. 7.3.9  Bootstrap Voltage and VBOOT-UVLO (BOOT Terminal)
      10. 7.3.10 Soft Start and Recovery from Dropout
        1. 7.3.10.1 Recovery from Dropout
      11. 7.3.11 Overcurrent Protection (Hiccup Mode)
      12. 7.3.12 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 Shutdown Mode
      2. 7.4.2 Standby Mode
      3. 7.4.3 Active Mode
        1. 7.4.3.1 CCM Mode
        2. 7.4.3.2 Auto Mode – Light-Load Operation
          1. 7.4.3.2.1 Diode Emulation
          2. 7.4.3.2.2 Frequency Reduction
        3. 7.4.3.3 FPWM Mode – Light-Load Operation
        4. 7.4.3.4 Minimum On-Time (High Input Voltage) Operation
        5. 7.4.3.5 Dropout
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1  Custom Design With WEBENCH® Tools
        2. 8.2.2.2  Choosing the Switching Frequency
        3. 8.2.2.3  Setting the Output Voltage
        4. 8.2.2.4  Input Capacitor Selection
        5. 8.2.2.5  Output Capacitor Selection
        6. 8.2.2.6  VCC
        7. 8.2.2.7  CFF Selection
        8. 8.2.2.8  Power-Good Signal
        9. 8.2.2.9  Maximum Ambient Temperature
        10. 8.2.2.10 Other Connections
      3. 8.2.3 Application Curves
    3. 8.3 Best Design Practices
    4. 8.4 Power Supply Recommendations
    5. 8.5 Layout
      1. 8.5.1 Layout Guidelines
        1. 8.5.1.1 Ground and Thermal Considerations
      2. 8.5.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Third-Party Products Disclaimer
      2. 9.1.2 Development Support
        1. 9.1.2.1 Custom Design With WEBENCH® Tools
      3. 9.1.3 Device Nomenclature
    2. 9.2 Documentation Support
      1. 9.2.1 Related Documentation
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.2.2.9 Maximum Ambient Temperature

As with any power conversion device, the TLVM236x5 dissipates internal power while operating. The effect of this power dissipation is to raise the internal temperature of the power module above ambient. The internal die and inductor temperature (TJ) is a function of the ambient temperature, the power loss, and the effective thermal resistance, RθJA, of the module and PCB combination. The maximum junction temperature for the TLVM236x5 must be limited to 125°C. This limit establishes a limit on the maximum module power dissipation and, therefore, the load current. Equation 14 shows the relationships between the important parameters. Seeing that larger ambient temperatures (TA) and larger values of RθJA reduce the maximum available output current is easy. The power module efficiency can be estimated by using the curves provided in this data sheet. If the desired operating conditions cannot be found in one of the curves, interpolation can be used to estimate the efficiency. Alternatively, the EVM can be adjusted to match the desired application requirements and the efficiency can be measured directly. The correct value of RθJA is more difficult to estimate. Lastly, safe-operation-area curves and module thermal captures developed through bench analysis on the EVM can be used to provide insights on the output power capability. These curves can be found in the Application Curves section of the data sheet.

As stated in the Semiconductor and IC Package Thermal Metrics application report the values given in Thermal Information section are not valid for design purposes and must not be used to estimate the thermal performance of the application. The values reported in that table were measured under a specific set of conditions that are rarely obtained in an actual application.

Equation 14. I O U T , m a x = ( T J - T A ) R θ J A × η ( 1 - η ) × 1 V O U T

where

  • η is the efficiency.

The effective RθJA (TLVM23625EVM = 22°C/W) is a critical parameter and depends on many factors such as the following:

  • Power dissipation
  • Air temperature/flow
  • PCB area
  • Copper heat-sink area
  • Adjacent component placement
  • Number of thermal vias under the package

The IC Power loss mentioned above is the overall power loss minus the loss that comes from the inductor DC resistance. The overall power loss can be approximated by using WEBENCH for a specific operating condition and temperature.

Use the following resources as guides to optimal thermal PCB design and estimating RθJA for a given application environment: