SNVSCN6 December   2023 TLVM365R1 , TLVM365R15

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 System Characteristics
    7. 6.7 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Enable, Shutdown, and Start-Up
      2. 7.3.2  Adjustable Switching Frequency (With RT)
      3. 7.3.3  Power-Good Output Operation
      4. 7.3.4  Internal LDO, VCC UVLO, and VOUT/FB Input
      5. 7.3.5  Bootstrap Voltage and VBOOT-UVLO (BOOT Terminal)
      6. 7.3.6  Output Voltage Selection
      7. 7.3.7  Soft Start and Recovery from Dropout
        1. 7.3.7.1 Soft Start
        2. 7.3.7.2 Recovery from Dropout
      8. 7.3.8  Current Limit and Short Circuit
      9. 7.3.9  Thermal Shutdown
      10. 7.3.10 Input Supply Current
    4. 7.4 Device Functional Modes
      1. 7.4.1 Shutdown Mode
      2. 7.4.2 Standby Mode
      3. 7.4.3 Active Mode
        1. 7.4.3.1 CCM Mode
        2. 7.4.3.2 AUTO Mode - Light Load Operation
          1. 7.4.3.2.1 Diode Emulation
          2. 7.4.3.2.2 Frequency Reduction
        3. 7.4.3.3 Minimum On-time Operation
        4. 7.4.3.4 Dropout
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1  Custom Design With WEBENCH® Tools
        2. 8.2.2.2  Choosing the Switching Frequency
        3. 8.2.2.3  Setting the Output Voltage
        4. 8.2.2.4  Input Capacitor Selection
        5. 8.2.2.5  Output Capacitor Selection
        6. 8.2.2.6  VCC
        7. 8.2.2.7  CFF Selection
        8. 8.2.2.8  External UVLO
        9. 8.2.2.9  Power-Good Signal
        10. 8.2.2.10 Maximum Ambient Temperature
        11. 8.2.2.11 Other Connections
      3. 8.2.3 Application Curves
    3. 8.3 Best Design Practices
    4. 8.4 Power Supply Recommendations
    5. 8.5 Layout
      1. 8.5.1 Layout Guidelines
      2. 8.5.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Device Nomenclature
      2. 9.1.2 Development Support
        1. 9.1.2.1 Custom Design With WEBENCH® Tools
    2. 9.2 Documentation Support
      1. 9.2.1 Related Documentation
    3. 9.3 Receiving Notification of Documentation Updates
    4. 9.4 Support Resources
    5. 9.5 Trademarks
    6. 9.6 Electrostatic Discharge Caution
    7. 9.7 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.2.2.10 Maximum Ambient Temperature

As with any power conversion device, the TLVM365R15 dissipates internal power while operating. The effect of this power dissipation is to raise the internal temperature of the power module above ambient. The internal die and inductor temperature (TJ) is a function of the ambient temperature, the power loss, and the effective thermal resistance, RθJA, of the module and PCB combination. The maximum junction temperature for the TLVM365R15 must be limited to 125°C. This limit establishes a limit on the maximum module power dissipation and, therefore, the load current. Equation 9 shows the relationships between the important parameters. Seeing that larger ambient temperatures (TA) and larger values of RθJA reduce the maximum available output current is easy. Being that the power dissipation is relatively low in this module, this device must be capable of supporting the maximum ambient temperature rating, across the majority of power conditions with a modest size 2 layer or 4 layer PCB. Further thermal analysis can be done by measuring the top case temperature on the EVM which is nearly equivalent to the junction due to the thin case.

As stated in the Semiconductor and IC Package Thermal Metrics application report, the values given in Section 6.4 section are not valid for design purposes and must not be used to estimate the thermal performance of the application. The values reported in that table were measured under a specific set of conditions that are rarely obtained in an actual application.

Equation 9. IOUT,max=(TJ-TA)RθJA×η(1-η)×1η

where

  • η is the efficiency.

The effective RθJA is a critical parameter and depends on many factors such as the following:

  • Power dissipation
  • Air temperature and flow
  • PCB area
  • Copper heat-sink area
  • Number of thermal vias under the package
  • Adjacent component placement

The IC Power loss mentioned above is the overall power loss minus the loss that comes from the inductor DC resistance. The overall power loss can be approximated by using WEBENCH for a specific operating condition and temperature.

Use the following resources as guides to optimal thermal PCB design and estimating RθJA for a given application environment: