SLYS048B March   2023  – August 2024 TMAG6181-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Magnetic Characteristics
    7. 5.7 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Magnetic Flux Direction
      2. 6.3.2 Sensors Location and Placement Tolerances
      3. 6.3.3 Magnetic Response
      4. 6.3.4 Parameters Definition
        1. 6.3.4.1 AMR Output Parameters
        2. 6.3.4.2 Transient Parameters
          1. 6.3.4.2.1 Power-On Time
        3. 6.3.4.3 Hall Sensor Parameters
        4. 6.3.4.4 Angle Accuracy Parameters
      5. 6.3.5 Automatic Gain Control (AGC)
      6. 6.3.6 Turns Counter
        1. 6.3.6.1 Rotation Tracking
      7. 6.3.7 Safety and Diagnostics
        1. 6.3.7.1 Device Level Checks
        2. 6.3.7.2 System Level Checks
    4. 6.4 Device Functional Modes
      1. 6.4.1 Operating Modes
        1. 6.4.1.1 Active Mode
        2. 6.4.1.2 Active-Turns Mode
        3. 6.4.1.3 Low-Power Mode
        4. 6.4.1.4 Sleep Mode
        5. 6.4.1.5 Fault Mode
  8. 7 Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Power Supply as the Reference for External ADC
      2. 7.1.2 AMR Output Dependence on Airgap Distance
      3. 7.1.3 Calibration of Sensor Errors
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
        1. 7.2.2.1 Designing with Multiple Sensors
          1. 7.2.2.1.1 Designing for Redundancy
          2. 7.2.2.1.2 Multiplexing Multiple Sensors
      3. 7.2.3 Application Curve
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Receiving Notification of Documentation Updates
    2. 8.2 Support Resources
    3. 8.3 Trademarks
    4. 8.4 Electrostatic Discharge Caution
    5. 8.5 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7 Application and Implementation

Note:

Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes, as well as validating and testing their design implementation to confirm system functionality.