SBOSA36A January   2021  – July 2021 TMCS1108

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Power Ratings
    6. 7.6 Electrical Characteristics
    7. 7.7 Typical Characteristics
      1. 7.7.1 Insulation Characteristics Curves
  8. 8 Parameter Measurement Information
    1. 8.1 Accuracy Parameters
      1. 8.1.1 Sensitivity Error
      2. 8.1.2 Offset Error and Offset Error Drift
      3. 8.1.3 Nonlinearity Error
      4. 8.1.4 Power Supply Rejection Ratio
      5. 8.1.5 Common-Mode Rejection Ratio
      6. 8.1.6 External Magnetic Field Errors
    2. 8.2 Transient Response Parameters
      1. 8.2.1 Slew Rate
      2. 8.2.2 Propagation Delay and Response Time
      3. 8.2.3 Current Overload Parameters
      4. 8.2.4 CMTI, Common-Mode Transient Immunity
    3. 8.3 Safe Operating Area
      1. 8.3.1 Continuous DC or Sinusoidal AC Current
      2. 8.3.2 Repetitive Pulsed Current SOA
      3. 8.3.3 Single Event Current Capability
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Current Input
      2. 9.3.2 High-Precision Signal Chain
        1. 9.3.2.1 Lifetime and Environmental Stability
        2. 9.3.2.2 Frequency Response
        3. 9.3.2.3 Transient Response
      3. 9.3.3 Internal Reference Voltage
      4. 9.3.4 Current-Sensing Measurable Ranges
    4. 9.4 Device Functional Modes
      1. 9.4.1 Power-Down Behavior
  10. 10Application and Implementation
    1. 10.1 Application Information
      1. 10.1.1 Total Error Calculation Examples
        1. 10.1.1.1 Room Temperature Error Calculations
        2. 10.1.1.2 Full Temperature Range Error Calculations
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
      3. 10.2.3 Application Curve
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Device Support
      1. 13.1.1 Development Support
    2. 13.2 Documentation Support
      1. 13.2.1 Related Documentation
    3. 13.3 Receiving Notification of Documentation Updates
    4. 13.4 Support Resources
    5. 13.5 Trademarks
    6. 13.6 Electrostatic Discharge Caution
    7. 13.7 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • D|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5 Device Comparison

Table 5-1 Device Comparison
PRODUCT SENSITIVITY ZERO CURRENT OUTPUT VOLTAGE, IIN LINEAR MEASUREMENT RANGE(1)
ΔVOUT / ΔIIN+, IN– VOUT,0A VS = 5 V VS = 3.3 V
TMCS1108A1B 50 mV/A 0.5 × VS ±46 A(2) ±29 A(2)
TMCS1108A2B 100 mV/A ±23 A(2) ±14.5 A
TMCS1108A3B 200 mV/A ±11.5 A ±7.25 A
TMCS1108A4B 400 mV/A ±5.75 A --
TMCS1108A1U 50 mV/A 0.1 × VS –9 A → 86 A(2) –5.6 A → 55.4A(2)
TMCS1108A2U 100 mV/A –4.5 A → 43A(2) –2.8 A → 27.7 A(2)
TMCS1108A3U 200 mV/A –2.25 A → 21.5 A(2) –1.4 A → 13.85 A
TMCS1108A4U 400 mV/A –1.12 A → 10.75 A --
(1) Linear range limited by swing to supply and ground.
(2) Current levels must remain below both allowable continuous DC/RMS and transient peak current safe operating areas to not exceed device thermal limits. See Safe Operating Area section.