SBOS581B September   2011  – June 2022 TMP100-Q1 , TMP101-Q1

PRODUCTION DATA  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Digital Temperature Output
      2. 7.3.2  Serial Interface
      3. 7.3.3  Bus Overview
      4. 7.3.4  Serial Bus Address
      5. 7.3.5  Writing and Reading to the TMP100-Q1 and TMP101-Q1
      6. 7.3.6  Target Mode Operations
        1. 7.3.6.1 Target Receiver Mode
        2. 7.3.6.2 Target Transmitter Mode
      7. 7.3.7  SMBus Alert Function
      8. 7.3.8  General Call
      9. 7.3.9  High-Speed Mode
      10. 7.3.10 POR (Power-On Reset)
      11. 7.3.11 Timing Diagrams
    4. 7.4 Device Functional Modes
      1. 7.4.1 Shutdown Mode (SD)
      2. 7.4.2 OS/ALERT (OS)
      3. 7.4.3 Thermostat Mode (TM)
      4. 7.4.4 Comparator Mode (TM = 0)
      5. 7.4.5 Interrupt Mode (TM = 1)
    5. 7.5 Programming
      1. 7.5.1 Pointer Register
        1. 7.5.1.1 Pointer Register Byte (pointer = N/A) [reset = 00h]
        2. 7.5.1.2 Pointer Addresses of the TMP100-Q1 and TMP101-Q1 Registers
      2. 7.5.2 Temperature Register
      3. 7.5.3 Configuration Register
        1. 7.5.3.1 Shutdown Mode (SD)
        2. 7.5.3.2 Thermostat Mode (TM)
        3. 7.5.3.3 Polarity (POL)
        4. 7.5.3.4 Fault Queue (F1, F0)
        5. 7.5.3.5 Converter Resolution (R1, R0)
        6. 7.5.3.6 OS/ALERT (OS)
      4. 7.5.4 High- and Low-Limit Registers
  8. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Examples
  11. 11Device and Documentation Support
    1. 11.1 Receiving Notification of Documentation Updates
    2. 11.2 Support Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Serial Bus Address

To program the TMP100-Q1 and TMP101-Q1 devices, the controller must first address target devices through a target address byte. The target address byte consists of seven address bits and a direction bit indicating the intent of executing a read or write operation.

The TMP100-Q1 device features two address pins to allow up to eight devices to be addressed on a single I2C interface. Table 7-2 describes the pin logic levels used to properly connect up to eight devices. Float indicates the pin is left unconnected. The state of pins ADD0 and ADD1 is sampled on the first I2C bus communication and must be set before any activity on the interface.

Table 7-2 Address Pins and Target Addresses for the TMP100-Q1
ADD1ADD0TARGET ADDRESS
001001000
0Float1001001
011001010
101001100
1Float1001101
111001110
Float01001011
Float11001111

The TMP101-Q1 device features one address pin and an ALERT pin, allowing up to three devices to be connected per bus. Pin logic levels are described in Table 7-3. The address pins of the TMP100-Q1 and TMP101-Q1 devices are read after reset or in response to an I2C address acquire request. Following reading, the state of the address pins is latched to minimize power dissipation associated with detection.

Table 7-3 Address Pins and Target Addresses for the TMP101-Q1
ADD0TARGET ADDRESS
01001000
Float1001001
11001010