SBOS581B September   2011  – June 2022 TMP100-Q1 , TMP101-Q1

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Digital Temperature Output
      2. 7.3.2  Serial Interface
      3. 7.3.3  Bus Overview
      4. 7.3.4  Serial Bus Address
      5. 7.3.5  Writing and Reading to the TMP100-Q1 and TMP101-Q1
      6. 7.3.6  Target Mode Operations
        1. 7.3.6.1 Target Receiver Mode
        2. 7.3.6.2 Target Transmitter Mode
      7. 7.3.7  SMBus Alert Function
      8. 7.3.8  General Call
      9. 7.3.9  High-Speed Mode
      10. 7.3.10 POR (Power-On Reset)
      11. 7.3.11 Timing Diagrams
    4. 7.4 Device Functional Modes
      1. 7.4.1 Shutdown Mode (SD)
      2. 7.4.2 OS/ALERT (OS)
      3. 7.4.3 Thermostat Mode (TM)
      4. 7.4.4 Comparator Mode (TM = 0)
      5. 7.4.5 Interrupt Mode (TM = 1)
    5. 7.5 Programming
      1. 7.5.1 Pointer Register
        1. 7.5.1.1 Pointer Register Byte (pointer = N/A) [reset = 00h]
        2. 7.5.1.2 Pointer Addresses of the TMP100-Q1 and TMP101-Q1 Registers
      2. 7.5.2 Temperature Register
      3. 7.5.3 Configuration Register
        1. 7.5.3.1 Shutdown Mode (SD)
        2. 7.5.3.2 Thermostat Mode (TM)
        3. 7.5.3.3 Polarity (POL)
        4. 7.5.3.4 Fault Queue (F1, F0)
        5. 7.5.3.5 Converter Resolution (R1, R0)
        6. 7.5.3.6 OS/ALERT (OS)
      4. 7.5.4 High- and Low-Limit Registers
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Examples
  11. 11Device and Documentation Support
    1. 11.1 Receiving Notification of Documentation Updates
    2. 11.2 Support Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.1 Application Information

The TMP100-Q1 and TMP101-Q1 devices are used to measure the printed circuit board (PCB) temperature of the board location where the devices are mounted. The TMP100-Q1 features two address pins to allow up to eight devices to be addressed on a single I2C interface. The TMP101-Q1 device features one address pin and an ALERT pin, allowing up to three devices to be connected per bus. The TMP100-Q1 and TMP101-Q1 devices require no external components for operation except for pullup resistors on SCL, SDA, and ALERT (TMP101-Q1 device), although a 0.1-μF bypass capacitor is recommended.

The sensing device of the TMP100-Q1 and TMP101-Q1 devices is the chip itself. Thermal paths run through the package leads as well as the plastic package. The die flag of the lead frame is connected to GND. The lower thermal resistance of metal causes the leads to provide the primary thermal path. The GND pin of the TMP100-Q1 or TMP101-Q1 device is directly connected to the metal lead frame, and is the best choice for thermal input.