SBOS716D May   2015  – January 2020 TMP107

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Typical Application
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Digital Temperature Output
      2. 7.3.2 Temperature Limits and Alert
        1. 7.3.2.1 ALERT1, ALERT2, R1, and R2 Pins
      3. 7.3.3 SMAART Wire™ Communication Interface
        1. 7.3.3.1 Communication Protocol
          1. 7.3.3.1.1 Calibration Phase
          2. 7.3.3.1.2 Command and Address Phase
            1. 7.3.3.1.2.1 Global or Individual (G/nI) Bit
            2. 7.3.3.1.2.2 Read/Write (R/nW) Bit
            3. 7.3.3.1.2.3 Command or Address (C/nA) Bit:
          3. 7.3.3.1.3 Register Pointer Phase
          4. 7.3.3.1.4 Data Phase
        2. 7.3.3.2 SMAART Wire™ Operations
          1. 7.3.3.2.1 Command Operations
            1. 7.3.3.2.1.1 Address Initialize
            2. 7.3.3.2.1.2 Last Device Poll
            3. 7.3.3.2.1.3 Global Software Reset
          2. 7.3.3.2.2 Address Operations
            1. 7.3.3.2.2.1 Individual Write
            2. 7.3.3.2.2.2 Individual Read
            3. 7.3.3.2.2.3 Global Write
            4. 7.3.3.2.2.4 Global Read
    4. 7.4 Device Functional Modes
      1. 7.4.1 Continuous-Conversion Mode
      2. 7.4.2 Shutdown Mode
      3. 7.4.3 One-Shot Mode
    5. 7.5 Programming
      1. 7.5.1 EEPROM
      2. 7.5.2 EEPROM Operations
        1. 7.5.2.1 EEPROM Unlock
        2. 7.5.2.2 EEPROM Lock
        3. 7.5.2.3 EEPROM Programming
        4. 7.5.2.4 EEPROM Acquire or Read
    6. 7.6 Register Map
      1. 7.6.1 Temperature Register (address = 0h) [reset = 0h]
        1. Table 4. Temperature Register Field Descriptions
      2. 7.6.2 Configuration Register (address = 1h) [reset = A000h]
        1. Table 5. Configuration Register Field Descriptions
      3. 7.6.3 High Limit 1 Register (address = 2h) [reset = 7FFCh]
        1. Table 7. High Limit 1 Register Field Descriptions
      4. 7.6.4 Low Limit 1 Register (address = 3h) [reset = 8000h]
        1. Table 8. Low Limit 1 Register Field Descriptions
      5. 7.6.5 High Limit 2 Register (address = 4h) [reset = 7FFCh]
        1. Table 9. High Limit 2 Register Field Descriptions
      6. 7.6.6 Low Limit 2 Register (address = 5h) [reset = 8000h]
        1. Table 10. Low Limit 2 Register Field Descriptions
      7. 7.6.7 EEPROM n Register (where n = 1 to 8) (addresses = 6h to Dh) [reset = 0h]
        1. Table 11. EEPROM Register bits
      8. 7.6.8 Die ID Register (address = Fh) [reset = 1107h]
        1. Table 12. Die ID Register Field Descriptions
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Connecting Multiple Devices
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Voltage Drop Effect
          2. 8.2.1.2.2 EEPROM Programming Current
          3. 8.2.1.2.3 Power Savings
          4. 8.2.1.2.4 Accuracy
          5. 8.2.1.2.5 Electromagnetic Interference (EMI)
        3. 8.2.1.3 Application Curves
      2. 8.2.2 Connecting ALERT1 and ALERT2 Pins
      3. 8.2.3 ALERT1 and ALERT2 Pins Used as General-Purpose Output (GPO)
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from C Revision (October 2018) to D Revision

  • Added footnote for biased operation up to 150°CGo

Changes from B Revision (September 2015) to C Revision

  • Changed text 'The baud rate is 9600 Kbps' to: The baud rate is 9600 bpsGo
  • Changed text 'Excellent eye diagram parameters are maintained at 9600 Kbps speed.' to: Excellent eye diagram parameters are maintained at 9600 bps speed.Go
  • Added Receiving Notification of Documentation Updates section Go

Changes from A Revision (August 2015) to B Revision

  • Changed baud values in Individual Read and Global Read sections from 2.5 to 1.5Go
  • Changed title and P[3:0] column headers of Table 3Go

Changes from * Revision (May 2015) to A Revision

  • Released to productionGo