SNIS233A February   2024  – July 2024 TMP110

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Related Products
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 I2C Interface Timing
    7. 6.7 Timing Diagrams
    8. 6.8 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Digital Temperature Output
      2. 7.3.2 Decoding Temperature Data
      3. 7.3.3 Temperature Limits and Alert
    4. 7.4 Device Functional Modes
      1. 7.4.1 Continuous-Conversion Mode
      2. 7.4.2 One-Shot Mode
    5. 7.5 Programming
      1. 7.5.1 Serial Interface
      2. 7.5.2 Bus Overview
      3. 7.5.3 Device Address
      4. 7.5.4 Bus Transactions
        1. 7.5.4.1 Writes
        2. 7.5.4.2 Reads
        3. 7.5.4.3 General Call Reset Function
        4. 7.5.4.4 SMBus Alert Response
        5. 7.5.4.5 Time-Out Function
        6. 7.5.4.6 Coexist on I3C Mixed Bus
  9. 8 Register Map
    1. 8.1 Temp_Result Register (address = 00h) [reset = xxxxh]
    2. 8.2 Configuration Register (address = 01h) [reset = 60A0h]
    3. 8.3 TLow_Limit Register (address = 02h) [reset = 4B00h]
    4. 8.4 THigh_Limit Register (address = 03h) [reset = 5000h]
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Equal I2C Pullup and Supply Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
      4. 9.2.4 Power Supply Recommendations
    3. 9.3 Layout
      1. 9.3.1 Layout Guidelines
      2. 9.3.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9.3.1 Layout Guidelines

The TMP110 is a simple device to layout. Place the power supply bypass capacitor as close to the device as possible. Pull up the open-drain output pin SDA through pullup resistor.