SNIS233A February   2024  – July 2024 TMP110

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Related Products
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 I2C Interface Timing
    7. 6.7 Timing Diagrams
    8. 6.8 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Digital Temperature Output
      2. 7.3.2 Decoding Temperature Data
      3. 7.3.3 Temperature Limits and Alert
    4. 7.4 Device Functional Modes
      1. 7.4.1 Continuous-Conversion Mode
      2. 7.4.2 One-Shot Mode
    5. 7.5 Programming
      1. 7.5.1 Serial Interface
      2. 7.5.2 Bus Overview
      3. 7.5.3 Device Address
      4. 7.5.4 Bus Transactions
        1. 7.5.4.1 Writes
        2. 7.5.4.2 Reads
        3. 7.5.4.3 General Call Reset Function
        4. 7.5.4.4 SMBus Alert Response
        5. 7.5.4.5 Time-Out Function
        6. 7.5.4.6 Coexist on I3C Mixed Bus
  9. 8 Register Map
    1. 8.1 Temp_Result Register (address = 00h) [reset = xxxxh]
    2. 8.2 Configuration Register (address = 01h) [reset = 60A0h]
    3. 8.3 TLow_Limit Register (address = 02h) [reset = 4B00h]
    4. 8.4 THigh_Limit Register (address = 03h) [reset = 5000h]
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Equal I2C Pullup and Supply Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
      4. 9.2.4 Power Supply Recommendations
    3. 9.3 Layout
      1. 9.3.1 Layout Guidelines
      2. 9.3.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.1 Temp_Result Register (address = 00h) [reset = xxxxh]

This register stores the latest temperature conversion result in a 12-bit or 13-bit two's complement format with a LSB equal to 0.0625°C depending on the Extended_Mode bit setting in the configuration register. The default format for the register at power up is normal mode.

Return to Register Map.

Table 8-3 Temp_Result Register (Normal Mode)
15141312111098
Temp_Result[11:4]
R-xxh
76543210
Temp_Result[3:0]Reserved
R-xhR-0000b
Table 8-4 Temp_Result Register (Extended Mode)
15141312111098
Temp_Result[12:5]
R-xxh
76543210
Temp_Result[4:0]Reserved
R-xxhR-001b
Table 8-5 Temp_Result Register Field Description (Normal Mode)
BitFieldTypeResetDescription
15:4Temp_Result[11:0]Rxxxh12-bit temperature conversion result
Temperature data is represented by a 12-bit, two's complement word with an LSB equal to 0.0625°C when Extended_Mode bit is 0b
3:0ReservedR0000bReserved
Table 8-6 Temp_Result Register Field Description (Extended Mode)
BitFieldTypeResetDescription
15:3Temp_Result[12:0] Rxxxxh13-bit temperature conversion result
Temperature data is represented by a 13-bit, two's complement word with an LSB equal to 0.0625°C when Extended_Mode bit is 1b
2:0ReservedR001bReserved

(The LSB is 1b)