SBOS473L March   2009  – July 2024 TMP112 , TMP112D

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Timing Diagrams
    8. 6.8 Typical Characteristics (TMP112A/B/N)
    9. 6.9 Typical Characteristics (TMP112Dx)
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagrams
    3. 7.3 Feature Description
      1. 7.3.1 Digital Temperature Output
      2. 7.3.2 Serial Interface
        1. 7.3.2.1 Bus Overview
        2. 7.3.2.2 Serial Bus Address
        3. 7.3.2.3 Writing and Reading Operation
        4. 7.3.2.4 Target Mode Operations
          1. 7.3.2.4.1 Target Receiver Mode
          2. 7.3.2.4.2 Target Transmitter Mode
        5. 7.3.2.5 SMBus Alert Function
        6. 7.3.2.6 General Call
        7. 7.3.2.7 High-Speed (Hs) Mode
        8. 7.3.2.8 Timeout Function
        9. 7.3.2.9 Timing Diagrams
          1. 7.3.2.9.1 Two-Wire Timing Diagrams
    4. 7.4 Device Functional Modes
      1. 7.4.1 Continuous-Conversion Mode
      2. 7.4.2 Extended Mode (EM)
      3. 7.4.3 One-Shot/Conversion Ready Mode (OS)
      4. 7.4.4 Thermostat Mode (TM)
        1. 7.4.4.1 Comparator Mode (TM = 0)
        2. 7.4.4.2 Interrupt Mode (TM = 1)
    5. 7.5 Programming
      1. 7.5.1 Pointer Register
      2. 7.5.2 Temperature Register
      3. 7.5.3 Configuration Register
        1. 7.5.3.1 Shutdown Mode (SD)
        2. 7.5.3.2 Thermostat Mode (TM)
        3. 7.5.3.3 Polarity (POL)
        4. 7.5.3.4 Fault Queue (F1/F0)
        5. 7.5.3.5 Converter Resolution (R1 and R0)
        6. 7.5.3.6 One-Shot (OS)
        7. 7.5.3.7 Extended Mode (EM)
        8. 7.5.3.8 Alert (AL)
      4. 7.5.4 High- and Low-Limit Register
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
      4. 8.2.4 Power Supply Recommendations
    3. 8.3 Layout
      1. 8.3.1 Layout Guidelines
      2. 8.3.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information
    1. 11.1 Tape and Reel Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DRL|6
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Device Comparison

Table 4-1 Device Options

Feature

TMP102

TMP110

TMP112A

TMP112B

TMP112N

TMP112Dx

TMP1075N

VDD Range (V)

1.4 - 3.6

1.14 - 5.5

1.4 - 3.6

1.4 - 3.6

1.4 - 3.6

1.4 - 3.6

1.62 - 3.6

IAVG (μA)
(Typ)

3.2 @ 1Hz
4.8 @ 4Hz

3.2 @ 1Hz

3.2 @ 1Hz
4.8 @ 4Hz

3.2 @ 1Hz
4.8 @ 4Hz		3.2 @ 1Hz
4.8 @ 4Hz

3.2 @ 1Hz
4.8 @ 4Hz

4.8 @ 4Hz

IQ_ACTIVE (μA)
(Typ)

55

55

55

55

55

55

-

ISB (μA)

2.6

2.6

2.6

2.6

2.6

2.6

-

ISD (μA)

0.15

0.15

0.15

0.15

0.15

0.15

0.15

Conversion
Time (ms) 		10101010101010

Accuracy

0°C to 65°C (max)

-

-

±0.5 @ 3.3V

±0.5 @ 1.8V

-

-

-

-10°C to 65°C (max)

-

-

-

-

-

-

±1

-25°C to 85°C (max)

±2

-

-

-

-

±0.5 @ ≥1.5V

-

-40°C to 125°C (max)

±3

±1

±1

±1±1

±1

±2

Packaging

Dimensions [mm × mm × mm]

SOT563-6
[1.6 × 1.6 × 0.6]

X2SON-5
[0.8 × 0.8 × 0.4]

SOT563-6
[1.6 × 1.6 × 0.6]		X2SON-5
[0.8 × 0.8 × 0.4]
SOT563-6
[1.6 × 1.6 × 0.6]

SOT563-6
[1.6 × 1.6 × 0.6]

Features

Address #

4

4

4

4

4

4

4

Address & Alert Programming

Address + Alert

Address or Alert

Address + Alert

Address or Alert
Address + Alert

Address + Alert