SBOS473L March 2009 – July 2024 TMP112 , TMP112D
PRODUCTION DATA
Refer to the PDF data sheet for device specific package drawings
THERMAL METRIC(1) | TMP112A/B/D/N | TMP112Dx | UNIT | |
---|---|---|---|---|
DRL (SOT563) | DPW (X2SON) | |||
6 PINS | 5 PINS | |||
RθJA | Junction-to-ambient thermal resistance | 240.2 | 230 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 96.4 | 194 | °C/W |
RθJB | Junction-to-board thermal resistance | 124.3 | 158.4 | °C/W |
ψJT | Junction-to-top characterization parameter | 4.0 | 20 | °C/W |
ψJB | Junction-to-board characterization parameter | 123.1 | 158.3 | °C/W |
RθJC(bot) | Junction-to-case (bottom) thermal resistance | N/A | 108.4 | °C/W |
MT | Thermal Mass | 1.97 | 0.46 | mJ/°C |