SBOS473L March   2009  – July 2024 TMP112 , TMP112D

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Timing Diagrams
    8. 6.8 Typical Characteristics (TMP112A/B/N)
    9. 6.9 Typical Characteristics (TMP112Dx)
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagrams
    3. 7.3 Feature Description
      1. 7.3.1 Digital Temperature Output
      2. 7.3.2 Serial Interface
        1. 7.3.2.1 Bus Overview
        2. 7.3.2.2 Serial Bus Address
        3. 7.3.2.3 Writing and Reading Operation
        4. 7.3.2.4 Target Mode Operations
          1. 7.3.2.4.1 Target Receiver Mode
          2. 7.3.2.4.2 Target Transmitter Mode
        5. 7.3.2.5 SMBus Alert Function
        6. 7.3.2.6 General Call
        7. 7.3.2.7 High-Speed (Hs) Mode
        8. 7.3.2.8 Timeout Function
        9. 7.3.2.9 Timing Diagrams
          1. 7.3.2.9.1 Two-Wire Timing Diagrams
    4. 7.4 Device Functional Modes
      1. 7.4.1 Continuous-Conversion Mode
      2. 7.4.2 Extended Mode (EM)
      3. 7.4.3 One-Shot/Conversion Ready Mode (OS)
      4. 7.4.4 Thermostat Mode (TM)
        1. 7.4.4.1 Comparator Mode (TM = 0)
        2. 7.4.4.2 Interrupt Mode (TM = 1)
    5. 7.5 Programming
      1. 7.5.1 Pointer Register
      2. 7.5.2 Temperature Register
      3. 7.5.3 Configuration Register
        1. 7.5.3.1 Shutdown Mode (SD)
        2. 7.5.3.2 Thermostat Mode (TM)
        3. 7.5.3.3 Polarity (POL)
        4. 7.5.3.4 Fault Queue (F1/F0)
        5. 7.5.3.5 Converter Resolution (R1 and R0)
        6. 7.5.3.6 One-Shot (OS)
        7. 7.5.3.7 Extended Mode (EM)
        8. 7.5.3.8 Alert (AL)
      4. 7.5.4 High- and Low-Limit Register
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
      4. 8.2.4 Power Supply Recommendations
    3. 8.3 Layout
      1. 8.3.1 Layout Guidelines
      2. 8.3.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)

10 Revision History

Changes from Revision K (June 2024) to Revision L (July 2024)

  • Updated the numbering format for tables, figures, and cross-references throughout the documentGo
  • Updated the typo for Average quiescent current “Serial bus active, SCL frequency = 2.85 MHz” typical value from 30µA to 40µAGo
  • Updated the typo for Shutdown current “Serial bus active, SCL frequency = 2.85 MHz” typical value from 25µA to 35µAGo
  • Updated empty graphs in the Typical Characteristics sectionGo
  • Updated the Temperature Step Response in the Application Curve section 0.8s to 1.2s due to changing the PCB size of mounted TMP112 from 0.375×0.437 inches to 0.5×0.5 inchesGo

Changes from Revision J (February 2024) to Revision K (June 2024)

  • Updated the numbering format for tables, figures, and cross-references throughout the documentGo
  • Changed the "Conversion time" for TMP112A/B/N throughout the documentGo
  • Changed the active, shutdown, average, and delay quiescent current for TMP112A/B/N throughout the documentGo
  • Added TMP112D (DRL packaged) throughout the documentGo
  • Changed DRL package Thermal Information sectionGo
  • Changed "Conversion time" in Electrical Characteristics table for TMP112A/B/N.Go
  • Changed and updated Average quiescent current specs for DRL package with DPW package in the Electrical Characteristics table.Go
  • Added Average quiescent current MAX to the “Serial bus inactive, CR1 = 0, CR0 = 1” in the Electrical Characteristics table.Go
  • Changed Average quiescent current “Serial bus inactive, CR1 = 1, CR0 = 0” for DRL package in Electrical Characteristics table.Go
  • Changed Average quiescent current “Serial bus active, SCL frequency = 400 kHz” for DRL package in Electrical Characteristics table.Go
  • Added Average quiescent current “Serial bus active, SCL frequency = 1 MHz” for DRL package in Electrical Characteristics table.Go
  • Changed Average quiescent current “Serial bus active, SCL frequency = 2.85 MHz” for DRL package in Electrical Characteristics table.Go
  • Changed the frequency from 3.4 to 2.85 MHz in the POWER SUPPLY section of the Electrical Characteristics table.Go
  • Changed and updated Shutdown current specs for DRL package with DPW package in the Electrical Characteristics table.Go
  • Changed Shutdown current “Serial bus inactive” for DRL package in the Electrical Characteristics table.Go
  • Changed Shutdown current “Serial bus active, SCL frequency = 400 kHz” for DRL package in Electrical Characteristics table.Go
  • Added Shutdown current “Serial bus active, SCL frequency = 1 MHz” for DRL package in Electrical Characteristics table.Go
  • Changed Shutdown current “Serial bus active, SCL frequency = 2.85 MHz” for DRL package in Electrical Characteristics table.Go
  • Changed Average Quiescent Current vs Temperature, Shutdown Current vs Temperature, Conversion Time vs Temperature, and Quiescent Current vs Bus Frequency graphs for TMP112A/B/N in the Typical Characteristics sectionGo

Changes from Revision I (December 2018) to Revision J (February 2024)

  • Updated the numbering format for tables, figures, and cross-references throughout the documentGo
  • Changed all instances of legacy terminology to controller and peripheral where I2C is mentioned Go
  • Added X2SON (DPW) package (TMP112Dx) and related information throughout the document Go
  • Changed reporting quiescent current from previous Maximum values to Typical values in the Features sectionGo
  • Added Device Comparison section Go
  • Added Output current (±10mA) to Absolute Maximum Ratings sectionGo
  • Added DPW package to Thermal Information sectionGo
  • Added Thermal Mass to Thermal Information sectionGo
  • Added TMP112Dx (DPW package) information to Electrical Characteristics Go
  • Changed “Timeout time” in description to “Timeout (SCL=GND or SDA=GND)”Go
  • Added Fast Mode Plus column to the Timing Requirements tableGo
  • Moved the "Two-Wire Timing Diagram" figure from the Two-Wire Timing Diagrams section to the Specifications section Go
  • Added TMP112Dx and TMP110 information to the Advantages of TMP112 Family Versus TMP102 and TMP110 table Go
  • Added 0.0625 and -0.0625 row to Temperature column of 12-Bit Temperature Data Format and 13-Bit Temperature Data Format tables in the Digital Temperature Output sectionGo
  • Updated Address and Alert Variant Device Target Address table in the Serial Bus Address section to include the new package (TMP112Dx) Go
  • Changed “Output Transfer Function Diagrams” figure to “Comparator Mode” and “Interrupt Mode” figures for more clarityGo
  • Added Layout Guidelines and Layout Example for new packageGo

Changes from Revision H (October 2018) to Revision I (December 2018)

  • Deleted Absolute Maximum Ratings for output voltage and replaced with pin level informationGo
  • Changed input voltage maximum to voltage maximum for SCL, ADD0 and SDA pinsGo
  • Added voltage at ALERT pin Absolute Maximum Ratings Go