SNOSD82D June   2018  – September 2022 TMP117

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Two-Wire Interface Timing
    8. 6.8 Timing Diagram
    9. 6.9 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagrams
    3. 7.3 Feature Description
      1. 7.3.1 Power Up
      2. 7.3.2 Averaging
      3. 7.3.3 Temperature Result and Limits
    4. 7.4 Device Functional Modes
      1. 7.4.1 Continuous Conversion Mode
      2. 7.4.2 Shutdown Mode (SD)
      3. 7.4.3 One-Shot Mode (OS)
      4. 7.4.4 Therm and Alert Modes
        1. 7.4.4.1 Alert Mode
        2. 7.4.4.2 Therm Mode
    5. 7.5 Programming
      1. 7.5.1 EEPROM Programming
        1. 7.5.1.1 EEPROM Overview
        2. 7.5.1.2 Programming the EEPROM
      2. 7.5.2 Pointer Register
      3. 7.5.3 I2C and SMBus Interface
        1. 7.5.3.1 Serial Interface
          1. 7.5.3.1.1 Bus Overview
          2. 7.5.3.1.2 Serial Bus Address
          3. 7.5.3.1.3 Writing and Reading Operation
          4. 7.5.3.1.4 Slave Mode Operations
            1. 7.5.3.1.4.1 Slave Receiver Mode
            2. 7.5.3.1.4.2 Slave Transmitter Mode
          5. 7.5.3.1.5 SMBus Alert Function
          6. 7.5.3.1.6 General-Call Reset Function
          7. 7.5.3.1.7 Timeout Function
          8. 7.5.3.1.8 Timing Diagrams
    6. 7.6 Register Map
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Noise and Averaging
        2. 8.2.2.2 Self-Heating Effect (SHE)
        3. 8.2.2.3 Synchronized Temperature Measurements
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Examples
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DRV|6
  • YBG|6
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from Revision C (April 2021) to Revision D (September 2022)

  • Changed device numbers in the Bus Overview sectionGo

Changes from Revision B (March 2019) to Revision C (April 2021)

  • Updated the numbering format for tables, figures, and cross-references throughout the documentGo
  • Changed minimum supply rating to 1.7 V for restricted temperature rangeGo
  • Updated minimum supply voltage in DescriptionGo
  • Added 1.7 V supply rating for in Recommended Operating ConditionsGo
  • Updated Long term stability and drift conditions from 300 hrs to 1000 hrsGo
  • Corrected ALERT Pin Output Voltage vs Pin Sink Current labelsGo
  • Added I2C behavior notesGo
  • Updated Power Supply Recommendations to reflect new 1.7 V supply ratingGo
  • Updated documentation linksGo

Changes from Revision A (October 2018) to Revision B (March 2019)

  • Moved the medical grade specs and RTD replacement information to the Features section Go
  • Changed application bulletsGo
  • Added YBG (DSBGA) package informationGo
  • Added YBG package accuracy imageGo
  • Changed accuracy image to indicate DRV packageGo
  • Changed TJ(MAX) from 150 °C to 155 °CGo
  • Added YBG package thermal informationGo
  • Added YBG package temperature accuracy chartGo
  • Changed conversion cycle timing diagramGo
  • Changed one-shot timing diagram with AVG[1:0] = 00Go
  • Changed alert mode timing diagramGo
  • Changed therm mode timing diagramGo
  • Changed write word command timing diagramGo
  • Changed read word command timing diagramGo
  • Changed SMBus alert timing diagramGo
  • Changed general-call reset command timing diagramGo
  • Updated the formatting in the Register Map sectionGo
  • Added return links to the register descriptionsGo
  • Fixed access type code location and descriptionsGo
  • Changed typical connections diagramGo
  • Added YBG package layout exampleGo

Changes from Revision * (June 2018) to Revision A (October 2018)

  • Changed device status from Advanced Information to Production Data Go
  • Changed shutdown current from: 250 nA to: 150 nA Go