SNIS236 January   2024 TMP119

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Two-Wire Interface Timing
    8. 6.8 Timing Diagram
    9. 6.9 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Power Up
      2. 7.3.2 Averaging
      3. 7.3.3 Temperature Result and Limits
      4. 7.3.4 Strain Tolerance
    4. 7.4 Device Functional Modes
      1. 7.4.1 Continuous Conversion Mode
      2. 7.4.2 Shutdown Mode (SD)
      3. 7.4.3 One-Shot Mode (OS)
      4. 7.4.4 Therm and Alert Modes
        1. 7.4.4.1 Alert Mode
        2. 7.4.4.2 Therm Mode
    5. 7.5 Programming
      1. 7.5.1 EEPROM Programming
        1. 7.5.1.1 EEPROM Overview
        2. 7.5.1.2 Programming the EEPROM
      2. 7.5.2 Pointer Register
      3. 7.5.3 I2C and SMBus Interface
        1. 7.5.3.1 Serial Interface
          1. 7.5.3.1.1 Bus Overview
          2. 7.5.3.1.2 Serial Bus Address
          3. 7.5.3.1.3 Writing and Reading Operation
          4. 7.5.3.1.4 Target Mode Operations
            1. 7.5.3.1.4.1 Target Receiver Mode
            2. 7.5.3.1.4.2 Target Transmitter Mode
          5. 7.5.3.1.5 SMBus Alert Function
          6. 7.5.3.1.6 General-Call Reset Function
          7. 7.5.3.1.7 Timeout Function
          8. 7.5.3.1.8 Timing Diagrams
  9. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 C-Code Decoding Temperature Data
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Noise and Averaging
        2. 8.2.2.2 Self-Heating Effect (SHE)
        3. 8.2.2.3 Synchronized Temperature Measurements
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
    5. 8.5 Register Map
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • YBG|6
Thermal pad, mechanical data (Package|Pins)
Orderable Information

3 Description

The TMP119 is a high-precision digital temperature sensor. The device is designed to help meet ASTM E1112 and ISO 80601 accuracy requirements for electronic patient thermometers. The TMP119 provides a 16-bit temperature result with a resolution of 0.0078°C and an accuracy of up to ±0.08°C across the temperature range of 0°C to 45°C with no calibration. The TMP119 has an interface that is I2C- and SMBus™-compatible, programmable alert functionality, and the device can support up to four devices on a single bus. Integrated EEPROM is included for device programming with an additional 48-bits memory available for general use. The TMP119 operates from 1.7V to 5.5V and typically consumes 3.5μA for a 1Hz conversion cycle.

For non-medical applications, the TMP119 can serve as a single chip digital alternative to a Platinum RTD. The TMP119 has an accuracy comparable to a Class AA RTD, while only using a fraction of the power of the power typically needed for a PT100 RTD. The TMP119 simplifies the design effort by removing many of the complexities of RTDs such as precision references, matched traces, complicated algorithms, and calibration. The device is designed to be strain tolerant, allowing robustness over typical strains often seen in PCB manufacturing, including device soldering, molding, underfill, and board flexing.

The TMP119 units are 100% tested on a production setup that is NIST traceable and verified with equipment that is calibrated to ISO/IEC 17025 accredited standards.

Package Information
PART NUMBER PACKAGE(1) PACKAGE SIZE(2)
TMP119 YBG (DSBGA, 6) 0.95mm × 1.488mm
(1) For all available packages, see Section 11.
(2) The package size (length × width) is a nominal value and includes pins, where applicable.
GUID-20240122-SS0I-X5SK-C9ZR-GTGDCZ2KRC3G-low.svg YBG Temperature Accuracy