SNIS217C december   2020  – may 2023 TMP139

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Switching Characteristics
    8. 6.8 Timing Diagrams
    9. 6.9 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Power-Up Sequence
      2. 7.3.2 Power-Down and Device Reset
      3. 7.3.3 Temperature Result and Limits
      4. 7.3.4 Bus Reset
      5. 7.3.5 Interrupt Generation
      6. 7.3.6 Parity Error Check
      7. 7.3.7 Packet Error Check
    4. 7.4 Device Functional Modes
      1. 7.4.1 Conversion Mode
      2. 7.4.2 Serial Address
      3. 7.4.3 I2C Mode Operation
        1. 7.4.3.1 Host I2C Write Operation
        2. 7.4.3.2 Host I2C Read Operation
        3. 7.4.3.3 Host I2C Read Operation in Default Read Address Pointer Mode
        4. 7.4.3.4 Switching from I2C Mode to I3C Basic Mode
      4. 7.4.4 I3C Basic Mode Operation
        1. 7.4.4.1 Host I3C Write Operation without PEC
        2. 7.4.4.2 Host I3C Write Operation with PEC
        3. 7.4.4.3 Host I3C Read Operation without PEC
        4. 7.4.4.4 Host I3C Read Operation with PEC
        5. 7.4.4.5 Host I3C Read Operation in Default Read Address Pointer Mode
      5. 7.4.5 In Band Interrupt
        1. 7.4.5.1 In Band Interrupt Arbitration Rules
        2. 7.4.5.2 In Band Interrupt Bus Transaction
      6. 7.4.6 Common Command Codes Support
        1. 7.4.6.1 ENEC CCC
        2. 7.4.6.2 DISEC CCC
        3. 7.4.6.3 RSTDAA CCC
        4. 7.4.6.4 SETAASA CCC
        5. 7.4.6.5 GETSTATUS CCC
        6. 7.4.6.6 DEVCAP CCC
        7. 7.4.6.7 SETHID CCC
        8. 7.4.6.8 DEVCTRL CCC
      7. 7.4.7 I/O Operation
      8. 7.4.8 Timing Diagrams
    5. 7.5 Programming
      1. 7.5.1 Enabling Interrupt Mechanism
      2. 7.5.2 Clearing Interrupt
    6. 7.6 Register Map
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  9. 9 Device and Documentation Support
    1. 9.1 Receiving Notification of Documentation Updates
    2. 9.2 Support Resources
    3. 9.3 Trademarks
    4. 9.4 Electrostatic Discharge Caution
    5. 9.5 Glossary
  10. 10Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • YAH|6
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.4.1 Layout Guidelines

Place the power-supply bypass capacitor as close as possible to the supply and ground pins as possible. The recommended value of this bypass capacitor is 0.01 µF. The SCL does not require a pull up as it is driven in push-pull mode by the hub device. The SDA does not require an external pull up, as in I3C the pull up resistor is integrated in the hub device as well.