SBOSA45D February   2022  – January 2025 TMP1826

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Description (cont.)
  6. 5 Device Comparison
  7. 6 Pin Configuration and Functions
  8. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 1-Wire® Interface Timing
    7. 7.7 EEPROM Characteristics
    8. 7.8 Timing Diagrams
    9. 7.9 Typical Characteristics
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Power Up
      2. 8.3.2  Power Mode Switch
      3. 8.3.3  Bus Pullup Resistor
      4. 8.3.4  Temperature Results
      5. 8.3.5  Temperature Offset
      6. 8.3.6  Temperature Alert
      7. 8.3.7  Standard Device Address
        1. 8.3.7.1 Unique 64-Bit Device Address and ID
      8. 8.3.8  Flexible Device Address
        1. 8.3.8.1 Non-Volatile Short Address
        2. 8.3.8.2 IO Hardware Address
        3. 8.3.8.3 Resistor Address
        4. 8.3.8.4 Combined IO and Resistor Address
      9. 8.3.9  CRC Generation
      10. 8.3.10 Functional Register Map
      11. 8.3.11 User Memory Map
      12. 8.3.12 Bit Communication
        1. 8.3.12.1 Host Write, Device Read
        2. 8.3.12.2 Host Read, Device Write
      13. 8.3.13 Bus Speed
      14. 8.3.14 NIST Traceability
    4. 8.4 Device Functional Modes
      1. 8.4.1 Conversion Modes
        1. 8.4.1.1 Basic One-Shot Conversion Mode
        2. 8.4.1.2 Auto Conversion Mode
        3. 8.4.1.3 Stacked Conversion Mode
        4. 8.4.1.4 Continuous Conversion Mode
      2. 8.4.2 Alert Function
        1. 8.4.2.1 Alert Mode
        2. 8.4.2.2 Comparator Mode
      3. 8.4.3 1-Wire® Interface Communication
        1. 8.4.3.1 Bus Reset Phase
        2. 8.4.3.2 Address Phase
          1. 8.4.3.2.1 READADDR (33h)
          2. 8.4.3.2.2 MATCHADDR (55h)
          3. 8.4.3.2.3 SEARCHADDR (F0h)
          4. 8.4.3.2.4 ALERTSEARCH (ECh)
          5. 8.4.3.2.5 SKIPADDR (CCh)
          6. 8.4.3.2.6 OVD SKIPADDR (3Ch)
          7. 8.4.3.2.7 OVD MATCHADDR (69h)
          8. 8.4.3.2.8 FLEXADDR (0Fh)
        3. 8.4.3.3 Function Phase
          1. 8.4.3.3.1  CONVERTTEMP (44h)
          2. 8.4.3.3.2  WRITE SCRATCHPAD-1 (4Eh)
          3. 8.4.3.3.3  READ SCRATCHPAD-1 (BEh)
          4. 8.4.3.3.4  COPY SCRATCHPAD-1 (48h)
          5. 8.4.3.3.5  WRITE SCRATCHPAD-2 (0Fh)
          6. 8.4.3.3.6  READ SCRATCHPAD-2 (AAh)
          7. 8.4.3.3.7  COPY SCRATCHPAD-2 (55h)
          8. 8.4.3.3.8  READ EEPROM (F0h)
          9. 8.4.3.3.9  GPIO WRITE (A5h)
          10. 8.4.3.3.10 GPIO READ (F5h)
      4. 8.4.4 NVM Operations
        1. 8.4.4.1 Programming User Data
        2. 8.4.4.2 Register and Memory Protection
          1. 8.4.4.2.1 Scratchpad-1 Register Protection
          2. 8.4.4.2.2 User Memory Protection
    5. 8.5 Programming
      1. 8.5.1 Single Device Temperature Conversion and Read
      2. 8.5.2 Multiple Device Temperature Conversion and Read
      3. 8.5.3 Register Scratchpad-1 Update and Commit
      4. 8.5.4 Single Device EEPROM Programming and Verify
      5. 8.5.5 Single Device EEPROM Page Lock Operation
      6. 8.5.6 Multiple Device IO Read
      7. 8.5.7 Multiple Device IO Write
    6. 8.6 Register Map
      1. 8.6.1  Temperature Result LSB Register (Scratchpad-1 offset = 00h) [reset = 00h]
      2. 8.6.2  Temperature Result MSB Register (Scratchpad-1 offset = 01h) [reset = 00h]
      3. 8.6.3  Status Register (Scratchpad-1 offset = 02h) [reset = 3Ch]
      4. 8.6.4  Device Configuration-1 Register (Scratchpad-1 offset = 04h) [reset = 70h]
      5. 8.6.5  Device Configuration-2 Register (Scratchpad-1 offset = 05h) [reset = 80h]
      6. 8.6.6  Short Address Register (Scratchpad-1 offset = 06h) [reset = 00h]
      7. 8.6.7  Temperature Alert Low LSB Register (Scratchpad-1 offset = 08h) [reset = 00h]
      8. 8.6.8  Temperature Alert Low MSB Register (Scratchpad-1 offset = 09h) [reset = 00h]
      9. 8.6.9  Temperature Alert High LSB Register (Scratchpad-1 offset = 0Ah) [reset = F0h]
      10. 8.6.10 Temperature Alert High MSB Register (Scratchpad-1 offset = 0Bh) [reset = 07h]
      11. 8.6.11 Temperature Offset LSB Register (Scratchpad-1 offset = 0Ch) [reset = 00h]
      12. 8.6.12 Temperature Offset MSB Register (Scratchpad-1 offset = 0Dh) [reset = 00h]
      13. 8.6.13 IO Read Register [reset = F0h]
      14. 8.6.14 IO Configuration Register [reset = 00h]
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 Bus Powered Application
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
      2. 9.2.2 Supply Powered Application
        1. 9.2.2.1 Design Requirements
        2. 9.2.2.2 Detailed Design Procedure
      3. 9.2.3 UART Interface for Communication
        1. 9.2.3.1 Design Requirements
        2. 9.2.3.2 Detailed Design Procedure
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.4.1.1 Basic One-Shot Conversion Mode

The basic one-shot conversion mode is the default conversion mode. The device goes through a bus reset, address and function phase to initiate the temperature conversion. During the communication, the device is in shutdown mode. When the conversion request is registered by the device, the device starts active conversion and then goes back to low power shutdown mode (see Figure 8-12). If the device is in continuous conversion mode, then the one-shot conversion mode request is ignored.

TMP1826 One-Shot Conversion ModeFigure 8-12 One-Shot Conversion Mode

As shown in Figure 8-13, there is no change in how one-shot conversion is performed when there are multiple devices on the bus. However, as there are multiple devices, the combined current drain in bus powered mode of operation can cause the bus voltage to drop. In such use cases,the host is required to implement a low impedance current path using a FET/transistor switch activated before tDELAY. This path is switched on to meet the current requirement of the bus during an active conversion and after the active conversion duration is complete, the path is switched off for bus communication.

TMP1826 Multiple Device One-Shot Conversion ModeFigure 8-13 Multiple Device One-Shot Conversion Mode