SBOS466B December   2009  – December 2018 TMP20

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Block Diagram
    2.     Device Quiescent Current Over Temperature
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Transfer Function
        1. 7.3.1.1 Example 1
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Output Drive and Capacitive Loads
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 TINA-TI (Free Download Software)
        1. 11.1.1.1 Using TINA-TI SPICE-Based Analog Simulation Program with the TMP20
      2. 11.1.2 Development Support
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.4 Thermal Information

THERMAL METRIC(1) TMP20 UNIT
DRL (SOT563) DCK (SC70)
6 PINS 5 PINS
RθJA Junction-to-ambient thermal resistance 238 185 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 253 263.3 °C/W
RθJB Junction-to-board thermal resistance 126.4 76.2 °C/W
ψJT Junction-to-top characterization parameter 126 51.3 °C/W
ψJB Junction-to-board characterization parameter 13 1.1 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 125.9 50.6 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.