SLOS889C October   2014  – September 2018 TMP302-Q1

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Trip Threshold Accuracy
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
    1.     Pin Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 HYSTSET
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Configuring the TMP302-Q1
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Receiving Notification of Documentation Updates
    2. 12.2 Community Resource
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from B Revision (July 2015) to C Revision

  • Changed the supply voltage maximum value from: 3.6 V to: 4 VGo
  • Changed the input pin supply voltage maximum value from: VS + 0.5 V to: VS + 0.3 and ≤ 4 VGo
  • Changed the output pin voltage maximum value from: 3.6 V to: 4 VGo
  • Added the specified temperature to the Recommended Operating Conditions table Go
  • Updated junction-to-ambient thermal resistance from 200 to 210.3 Go
  • Updated junction-to-case (top) thermal resistance from 73.7 to 105.0 Go
  • Updated junction-to-board thermal resistance from 34.4 to 87.5 Go
  • Updated junction-to-top characterization parameter from 3.1 to 6.1 Go
  • Updated junction-to-board characterization parameter from 34.2 to 87.0 Go
  • Changed the Design Requirements section Go
  • Added the Receiving Notification of Documentation Updates sectionGo

Changes from A Revision (November 2014) to B Revision

  • Changed the Handling Ratings table to ESD Ratings and moved storage temperature to the Absolute Maximum Ratings table Go

Changes from * Revision (October 2014) to A Revision

  • Changed device status From: Product Preview To: ProductionGo