SBOS441I September   2009  – October 2019 TMP431 , TMP432

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Typical Application Schematics
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Temperature Measurement Data
      2. 8.3.2 Beta Compensation
      3. 8.3.3 Series Resistance Cancellation
      4. 8.3.4 Differential Input Capacitance
      5. 8.3.5 Filtering
      6. 8.3.6 Sensor Fault
      7. 8.3.7 THERM and ALERT/THERM2
    4. 8.4 Device Functional Modes
      1. 8.4.1 Shutdown Mode (SD)
      2. 8.4.2 One-Shot Mode
    5. 8.5 Programming
      1. 8.5.1  Serial Interface
      2. 8.5.2  Bus Overview
      3. 8.5.3  Timing Diagrams
      4. 8.5.4  Serial Bus Address
      5. 8.5.5  Read and Write Operations
      6. 8.5.6  Undervoltage Lockout
      7. 8.5.7  Timeout Function
      8. 8.5.8  High-Speed Mode
      9. 8.5.9  General Call Reset
      10. 8.5.10 SMBus Alert Function
    6. 8.6 Register Maps
      1. 8.6.1  Pointer Register
      2. 8.6.2  Temperature Registers
      3. 8.6.3  Limit Registers
      4. 8.6.4  Status Registers
        1. 8.6.4.1 TMP431 Status Register
        2. 8.6.4.2 TMP432 Status Register
      5. 8.6.5  Configuration Register 1
      6. 8.6.6  Configuration Register 2
      7. 8.6.7  Conversion Rate Register
      8. 8.6.8  Beta Compensation Configuration Register
      9. 8.6.9  η-Factor Correction Register
      10. 8.6.10 Software Reset
      11. 8.6.11 Consecutive Alert Register
      12. 8.6.12 Therm Hysteresis Register
      13. 8.6.13 Identification Registers
      14. 8.6.14 Open Status Register
      15. 8.6.15 Channel Mask Register
      16. 8.6.16 High Limit Status Register
      17. 8.6.17 Low Limit Status Register
      18. 8.6.18 THERM Limit Status Register
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Examples
  12. 12Device and Documentation Support
    1. 12.1 Related Links
    2. 12.2 Community Resources
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.4 Thermal Information

THERMAL METRIC(1) TMP431 TMP432 UNIT
DGK (VSSOP) DGS (VSSOP)
8 PINS 10 PINS
RθJA Junction-to-ambient thermal resistance 168.2 164.6 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 59.7 39 °C/W
RθJB Junction-to-board thermal resistance 90.1 85.9 °C/W
ψJT Junction-to-top characterization parameter 7.7 1.6 °C/W
ψJB Junction-to-board characterization parameter 88.4 84.2 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A N/A °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.