SBOS686A June   2013  – December 2014 TMP451

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Temperature Measurement Data
        1. 7.3.1.1 Standard Binary-to-Decimal Temperature Data Calculation Example
        2. 7.3.1.2 Standard Decimal-to-Binary Temperature Data Calculation Example
      2. 7.3.2 Series Resistance Cancellation
      3. 7.3.3 Differential Input Capacitance
      4. 7.3.4 Filtering
      5. 7.3.5 Sensor Fault
      6. 7.3.6 ALERT and THERM Functions
    4. 7.4 Device Functional Modes
      1. 7.4.1 Shutdown Mode (SD)
      2. 7.4.2 One-shot Mode
    5. 7.5 Programming
      1. 7.5.1 Serial Interface
        1. 7.5.1.1 Bus Overview
        2. 7.5.1.2 Bus Definitions
        3. 7.5.1.3 Serial Bus Address
        4. 7.5.1.4 Read and Write Operations
        5. 7.5.1.5 Time-out Function
        6. 7.5.1.6 High-speed Mode
        7. 7.5.1.7 General Call Reset
    6. 7.6 Register Map
      1. 7.6.1 Register Information
        1. 7.6.1.1  Pointer Register
        2. 7.6.1.2  Temperature Registers
        3. 7.6.1.3  Local Temperature High Byte Register (offset: Read = 00h; Write = N/A) [reset = 00h]
        4. 7.6.1.4  Remote Temperature High Byte Register (offset: Read = 01h; Write = N/A) [reset = 00h]
        5. 7.6.1.5  Status Register (offset: Read = 02h; Write = N/A) [reset = N/A]
        6. 7.6.1.6  Configuration Register (offset: Read = 03h; Write = 09h) [reset = 00h]
        7. 7.6.1.7  Conversion Rate Register (offset: Read = 04h; Write = 0Ah) [reset = 08h]
        8. 7.6.1.8  Local Temperature High Limit Register (offset: Read = 05h; Write = 0Bh) [reset = 55h]
        9. 7.6.1.9  Local Temperature Low Limit Register (offset: Read = 06h; Write = 0Ch) [reset = 00h]
        10. 7.6.1.10 Remote Temperature High Limit High Byte Register (offset: Read = 07h; Write = 0Dh) [reset = 55h]
        11. 7.6.1.11 Remote Temperature Low Limit High Byte Register (offset: Read = 08h; Write = 0Eh) [reset = 00h]
        12. 7.6.1.12 One-shot Start Register (offset: Read = N/A; Write = 0Fh) [reset = N/A]
        13. 7.6.1.13 Remote Temperature Low Byte Register (offset: Read = 10h; Write = N/A) [reset = 00h]
        14. 7.6.1.14 Remote Temperature Offset High Byte Register (offset: Read = 11h; Write = 11h) [reset = 00h]
        15. 7.6.1.15 Remote Temperature Offset Low Byte Register (offset: Read = 12h; Write = 12h) [reset = 00h]
        16. 7.6.1.16 Remote Temperature High Limit Low Byte Register (offset: Read = 13h; Write = 13h) [reset = 00h]
        17. 7.6.1.17 Remote Temperature Low Limit Low Byte Register (offset: Read = 14h; Write = 14h) [reset = 00h]
        18. 7.6.1.18 Local Temperature Low Byte Register (offset: Read = 15h; Write = N/A) [reset = 00h]
        19. 7.6.1.19 Remote Temperature THERM Limit Register (offset: Read = 19h; Write = 19h) [reset = 6C]
        20. 7.6.1.20 Local Temperature THERM Limit Register (offset: Read = 20h; Write = 20h) [reset = 55]
        21. 7.6.1.21 THERM Hysteresis Register (offset: Read = 21h; Write = 21h) [reset = 0Ah]
        22. 7.6.1.22 Consecutive ALERT Register (offset: Read = 22h; Write = 22h) [reset = 01h]
        23. 7.6.1.23 η-Factor Correction Register (offset: Read = 23h; Write = 23h) [reset = 00h]
        24. 7.6.1.24 Digital Filter Control Register (offset: Read = 24h; Write = 24h) [reset = 00h]
        25. 7.6.1.25 Manufacturer ID Register (offset: Read = FEh; Write = N/A) [reset = 55]
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Trademarks
    2. 11.2 Electrostatic Discharge Caution
    3. 11.3 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from * Revision (June 2013) to A Revision

  • Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section Go