SCDS381 august   2023 TMUX121

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Revision History
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Enable and Low Power Mode
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Signal Expansion (I3C and I2C)
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.6 Switching Characteristics

over operating free-air temperature and supply voltage range (unless otherwise noted)
PARAMETER MIN TYP MAX UNIT
tTRAN Transition time from control input (SEL) RL = 50 Ω, CL = 10 pF 1 µs
tON Turn-on time from control input (EN) RL = 50 Ω, CL = 10 pF 16 µs
tOFF Turn-off time from control input (EN) RL = 50 Ω, CL = 10 pF 0.5 µs
tPD Switch propagation delay (Sx to Dx or Dx to Sx) 60 80 ps
tSKEW_INTRA Intra-pair propagation delay skew for same channel  2 10 ps
tSKEW_INTER Inter-pair propagation delay skew between channels 2 10 ps
BW –3-dB bandwidth 3 GHz
IL Differential insertion loss f = 10 MHz -0.3 dB
OISO Differential OFF isolation (D to SA/SB) f = 10 MHz -56 dB
XTALK Differential cross-talk (SA to SB or SB to SA) f = 10 MHz -64 dB
CS(ON)
CD(ON)		 On capacitance f = 10 MHz 1.7 pF