SCDS390A September   2018  – December 2018 TMUX1511

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Application Example
      2.      Block Diagram
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Dynamic Characteristics
    7. 6.7 Timing Requirements
    8. 6.8 Typical Characteristics
      1. 6.8.1 Eye Diagrams
  7. 7 Parameter Measurement Information
    1. 7.1  On-Resistance
    2. 7.2  Off-Leakage Current
    3. 7.3  On-Leakage Current
    4. 7.4  IPOFF Leakage Current
    5. 7.5  Transition Time
    6. 7.6  TON (VDD) and TOFF (VDD) Time
    7. 7.7  Propagation Delay
    8. 7.8  Skew
    9. 7.9  Charge Injection
    10. 7.10 Capacitance
    11. 7.11 Off Isolation
    12. 7.12 Channel-to-Channel Crosstalk
    13. 7.13 Bandwidth
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Bidirectional Operation
      2. 8.3.2 Beyond Supply Operation
      3. 8.3.3 1.8 V Logic Compatible Inputs
      4. 8.3.4 Powered-off Protection
      5. 8.3.5 Fail-Safe Logic
      6. 8.3.6 Low Capacitance
      7. 8.3.7 Integrated Pull-Down Resistors
    4. 8.4 Device Functional Modes
    5. 8.5 Truth Tables
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Protocol / Signal Isolation
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Application Curves
      2. 9.2.2 Transimpedance Amplifier Feedback Control
        1. 9.2.2.1 Design Requirements
        2. 9.2.2.2 Detailed Design Procedure
        3. 9.2.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Community Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.6 Dynamic Characteristics

VDD = 1.5 V to 5.5 V, GND = 0 V, TA = –40°C to +125°C,
Typical values are at VDD = 3.3 V, TA = 25°C, (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
COFF Source and drain off capacitance VS = VDD / 2
VSEL= 0 V
f = 1 MHz
Refer to Capacitance Figure 		Switch OFF 2.5 4 pF
CON Source and drain on capacitance VS = VDD / 2
VSEL = VDD
f = 1 MHz
Refer to Capacitance Figure 		Switch ON 3.3 6 pF
QC Charge Injection VS = VDD / 2
RS = 0 Ω, CL = 100 pF
Refer to Charge Injection Figure 		Switch ON 2 pC
OISO Off isolation RL = 50 Ω
f = 100 kHz
Refer to Off Isolation Figure 		Switch OFF –90 dB
RL = 50 Ω
f = 1 MHz
Refer to Off Isolation Figure 		Switch OFF –75 dB
XTALK Channel to Channel crosstalk RL = 50 Ω
f = 100 kHz
Refer to Crosstalk Figure 		Switch ON –90 dB
BW Bandwidth RL = 50 Ω
Refer to Bandwidth Figure 		Switch ON 3 GHz
ILOSS Insertion loss RL = 50 Ω
f = 1 MHz
Refer to Bandwidth Figure 		Switch ON –0.12 dB