TMUX1511

ACTIVE

Product details

Configuration 1:1 SPST Number of channels 4 Power supply voltage - single (V) 1.8, 2.5, 3.3, 5 Protocols Analog, I2C, I2S, JTAG, RGMII, SPI, TDM, UART Ron (typ) (Ω) 2 CON (typ) (pF) 3.3 ON-state leakage current (max) (µA) 0.05 Supply current (typ) (µA) 37 Bandwidth (MHz) 3000 Operating temperature range (°C) -40 to 125 Features 1.8-V compatible control inputs, Fail-safe logic, Integrated pulldown resistor on logic pin, Powered-off protection, Supports input voltage beyond supply Input/output continuous current (max) (mA) 25 Rating Catalog Drain supply voltage (max) (V) 5.5 Supply voltage (max) (V) 5.5
Configuration 1:1 SPST Number of channels 4 Power supply voltage - single (V) 1.8, 2.5, 3.3, 5 Protocols Analog, I2C, I2S, JTAG, RGMII, SPI, TDM, UART Ron (typ) (Ω) 2 CON (typ) (pF) 3.3 ON-state leakage current (max) (µA) 0.05 Supply current (typ) (µA) 37 Bandwidth (MHz) 3000 Operating temperature range (°C) -40 to 125 Features 1.8-V compatible control inputs, Fail-safe logic, Integrated pulldown resistor on logic pin, Powered-off protection, Supports input voltage beyond supply Input/output continuous current (max) (mA) 25 Rating Catalog Drain supply voltage (max) (V) 5.5 Supply voltage (max) (V) 5.5
TSSOP (PW) 14 32 mm² 5 x 6.4 UQFN (RSV) 16 4.68 mm² 2.6 x 1.8
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Design & development

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Interface adapter

LEADED-ADAPTER1 — Surface mount to DIP header adapter for quick testing of TI's 5, 8, 10, 16 & 24-pin leaded packages

The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages.  The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.     

User guide: PDF
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Interface adapter

LEADLESS-ADAPTER1 — Surface mount to DIP header adapter for testing of TI's 6,8,10,12,14,16, & 20-pin leadless packages

The EVM-LEADLESS1 board allows for quick testing and bread boarding of TI's common leadless packages.  The board has footprints to convert TI's DRC, DTP, DQE, RBW, RGY, RSE, RSV, RSW RTE, RTJ, RUK , RUC, RUG, RUM,RUT and YZP surface mount packages to 100mil DIP headers.
User guide: PDF
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Simulation model

TMUX1511 IBIS Model

SCDM193.ZIP (11 KB) - IBIS Model
Simulation model

TMUX1511 S-Parameter Model

SCDM203.ZIP (7933 KB) - S-Parameter Model
Simulation model

TMUX1511PW PSPICE Model

SCDM236.ZIP (19 KB) - PSpice Model
Package Pins CAD symbols, footprints & 3D models
TSSOP (PW) 14 Ultra Librarian
UQFN (RSV) 16 Ultra Librarian

Ordering & quality

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Support & training

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