SCDS379 February   2018 TMUX154E

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Functional Block Diagram
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Dynamic Electrical Characteristics
    7. 6.7 Switching Characteristics
    8. 6.8 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Community Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.5 Electrical Characteristics

over operating free-air temperature range (unless otherwise noted)(1)
PARAMETERTEST CONDITIONSMINTYP(2)MAXUNIT
ISEL , IEN Control inputs VCC = 4.3 V, 0 V, VSEL,VEN = 0 to 4.3 V ±1 μA
IOZ OFF-state leakage current(3) VCC = 4.3 V, VO = 0 to 3.6 V, VI = 0,
Switch OFF 		±1 μA
IOFF Powered off leakage current VCC = 0 V, VAn,Bn = 0 V, VA,B = 0 V to 4.3 V,
VSEL , VEN = VCC or GND 		±2 μA
ICC Supply current VCC = 4.3 V, II/O = 0,
Switch ON or OFF		 1 μA
ΔICC(4) Difference of supply current due to control input voltage not VCC or GND VCC = 4.3 V, VSELVEN = 2.6 V 10 μA
CSEL, CEN Control inputs digital input capacitance VCC = 0 V,
VSELVEN = VCC or GND		 1 pF
CI/O(OFF) OFF-state input capacitance VCC = 3.3 V, VI/O = 3.3 V or 0,
Switch OFF		 2 pF
CI/O(ON) ON-state input capacitance VCC = 3.3 V, VI/O = 3.3 V or 0,
Switch ON		 7.5 pF
RON ON-state resistance(5) VCC = 3 V, VI = 0.4, IO = –8 mA 6 10 Ω
ΔRON ON-state resistance match between channels VCC = 3 V, VI = 0.4, IO = –8 mA 0.35 Ω
ron(flat) ON-state resistance flatness VCC = 3 V, VI = 0 V or 1 V, IO = –8 mA 2 Ω
(1) VI, VO, II, and IO refer to data I/O pins A, B, An, and Bn.
(2) All typical values are at VCC = 3.3 V (unless otherwise noted), TA = 25°C.
(3) For I/O ports, the parameter IOZ includes the input leakage current.
(4) This is the increase in supply current for each digital control input that is supplied with a voltage other than VCC or GND.
(5) Measured by the voltage drop between the A and B terminals at the indicated current through the switch. ON-state resistance is determined by the lower of the voltages of the two (A or B) terminals.