SCDS463A June   2022  – March 2023 TMUX4051-Q1 , TMUX4052-Q1

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Thermal Information: TMUX4051-Q1
    4. 7.4 Thermal Information: TMUX4052-Q1
    5. 7.5 Recommended Operating Conditions
    6. 7.6 Electrical Characteristics
    7. 7.7 AC Performance Characteristics
    8. 7.8 Timing Characteristics
    9. 7.9 Typical Characteristics
  8. 8 Parameter Measurement Information
    1. 8.1  On-Resistance
    2. 8.2  Off-Leakage Current
    3. 8.3  On-Leakage Current
    4. 8.4  Transition Time
    5. 8.5  Break-Before-Make
    6. 8.6  tON(EN) and tOFF(EN)
    7. 8.7  Propagation Delay
    8. 8.8  Charge Injection
    9. 8.9  Off Isolation
    10. 8.10 Crosstalk
    11. 8.11 Bandwidth
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Bidirectional Operation
      2. 9.3.2 Rail-to-Rail Operation
      3. 9.3.3 1.8 V Logic Compatible Inputs
      4. 9.3.4 Device Functional Modes
      5. 9.3.5 Truth Tables
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
    3. 10.3 Design Requirements
    4. 10.4 Detailed Design Procedure
    5. 10.5 Application Curves
    6. 10.6 Power Supply Recommendations
    7. 10.7 Layout
      1. 10.7.1 Layout Guidelines
      2. 10.7.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • BQB|16
  • PW|16
  • DYY|16
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.8 Timing Characteristics

Over operating free-air temperature range,
Typical at TA = 25℃ (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
CONDITION VDD VSS TA
Prop Delay Signal Input
to
Signal Output		 VS = VSS to VDD 5 V 0 V 25°C 4 20 ns
10 V 0 V 25°C 4 20
24 V 0 V 25°C 3 20
5 V –5 V 25°C 4 20
12 V –12 V 25°C 3 20
tTRAN Address-to-Signal OUT
Transition time between inputs		 tr , tf = 20 ns,
CL = 50 pF,
RL = 10 kΩ		 5 V 0 V 25°C 105 ns
–55°C to +125°C 190
10 V 0 V 25°C 100
–55°C to +125°C 190
24 V 0 V 25°C 110
–55°C to +125°C 230
5 V –5 V 25°C 100
–55°C to +125°C 190
12 V –12 V 25°C 100
–55°C to +125°C 190
tON (EN) Enable-to-Signal OUT
Channel turning ON		 tr , tf = 20 ns,
CL = 50 pF,
RL = 10 kΩ		 5 V 0 V 25°C 100 ns
–55°C to +125°C 190
10 V 0 V 25°C 95
–55°C to +125°C 190
24 V 0 V 25°C 110
–55°C to +125°C 230
5 V –5 V 25°C 100
–55°C to +125°C 190
12 V –12 V 25°C 100
–55°C to +125°C 190
tOFF (EN) Enable-to-Signal OUT
Channel turning OFF		 tr , tf = 20 ns,
CL = 50 pF,
RL = 10 kΩ		 5 V 0 V 25°C 90 ns
–55°C to +125°C 140
10 V 0 V 25°C 90
–55°C to +125°C 140
24 V 0 V 25°C 85
–55°C to +125°C 140
5 V –5 V 25°C 100
–55°C to +125°C 160
12 V –12 V 25°C 90
–55°C to +125°C 140
tBBM CL = 15 pF,
RL = 10 kΩ		 5 V 0 V 25°C 60 ns
–55°C to +125°C 1
10 V 0 V 25°C 45
–55°C to +125°C 1
5 V –5 V 25°C 45
–55°C to +125°C 1
12 V –12 V 25°C 55
–55°C to +125°C 1
24 V 0 V 25°C 75
–55°C to +125°C 1