SCDS463A June 2022 – March 2023 TMUX4051-Q1 , TMUX4052-Q1
PRODUCTION DATA
Refer to the PDF data sheet for device specific package drawings
THERMAL METRIC (1) | TMUX4051-Q1 | UNIT | |||
---|---|---|---|---|---|
PW (TSSOP) | DYY (SOT) | BQB (WQFN) | |||
16 PINS | 16 PINS | 16 PINS | |||
RθJA | Junction-to-ambient thermal resistance | 116.5 | 138.9 | 70.5 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 47.2 | 70.3 | 67.8 | °C/W |
RθJB | Junction-to-board thermal resistance | 63.0 | 69.1 | 40.2 | °C/W |
ΨJT | Junction-to-top characterization parameter | 6.4 | 5.1 | 3.9 | °C/W |
ΨJB | Junction-to-board characterization parameter | 62.1 | 69.0 | 40.2 | °C/W |
RθJC(bot) | Junction-to-case (bottom) thermal resistance | N/A | N/A | 18.7 | °C/W |