SCDS463A June   2022  – March 2023 TMUX4051-Q1 , TMUX4052-Q1

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Thermal Information: TMUX4051-Q1
    4. 7.4 Thermal Information: TMUX4052-Q1
    5. 7.5 Recommended Operating Conditions
    6. 7.6 Electrical Characteristics
    7. 7.7 AC Performance Characteristics
    8. 7.8 Timing Characteristics
    9. 7.9 Typical Characteristics
  8. 8 Parameter Measurement Information
    1. 8.1  On-Resistance
    2. 8.2  Off-Leakage Current
    3. 8.3  On-Leakage Current
    4. 8.4  Transition Time
    5. 8.5  Break-Before-Make
    6. 8.6  tON(EN) and tOFF(EN)
    7. 8.7  Propagation Delay
    8. 8.8  Charge Injection
    9. 8.9  Off Isolation
    10. 8.10 Crosstalk
    11. 8.11 Bandwidth
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Bidirectional Operation
      2. 9.3.2 Rail-to-Rail Operation
      3. 9.3.3 1.8 V Logic Compatible Inputs
      4. 9.3.4 Device Functional Modes
      5. 9.3.5 Truth Tables
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
    3. 10.3 Design Requirements
    4. 10.4 Detailed Design Procedure
    5. 10.5 Application Curves
    6. 10.6 Power Supply Recommendations
    7. 10.7 Layout
      1. 10.7.1 Layout Guidelines
      2. 10.7.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • BQB|16
  • PW|16
  • DYY|16
Thermal pad, mechanical data (Package|Pins)
Orderable Information

10.2 Typical Application

One useful application to take advantage of the TMUX405x-Q1 features is multiplexing various signals into an ADC that is integrated into an MCU. Utilizing an integrated ADC in an MCU allows a system to minimize cost with a potential tradeoff of system performance when compared to an external ADC. The multiplexer allows for multiple inputs or sensors to be monitored with a single ADC pin of the device, which is critical in systems with limited I/O. The TMUX4052-Q1 is suitable for a similar design example using differential signals, or as two 4:1 multiplexers.

GUID-20220607-SS0I-8GT4-FBF9-GL9QCSQ6CZVV-low.svgFigure 10-1 Multiplexing Signals to an Integrated ADC with TMUX4051