SCDS457B May   2023  – July 2024 TMUX4827

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Thermal Information
    4. 5.4 Recommended Operating Conditions
    5. 5.5 Source or Drain Continuous Current
    6. 5.6 Source or Drain RMS Current
    7. 5.7 Electrical Characteristics 
    8. 5.8 Switching Characteristics 
    9. 5.9 Typical Characteristics
  7. 6 Parameter Measurement Information
    1. 6.1  On-Resistance
    2. 6.2  On-Leakage Current
    3. 6.3  Off-Leakage Current
    4. 6.4  Power-Off Leakage Current
    5. 6.5  Propagation Delay
    6. 6.6  tON (VDD) and tOFF (VDD) Time
    7. 6.7  Transition Time
    8. 6.8  Break-Before-Make
    9. 6.9  THD + Noise
    10. 6.10 Power Supply Rejection Ratio (PSRR)
    11. 6.11 Charge Injection
    12. 6.12 Bandwidth
    13. 6.13 Off Isolation
    14. 6.14 Crosstalk
  8. 7 Detailed Description
    1. 7.1 Functional Block Diagram
    2. 7.2 Device Functional Modes
    3. 7.3 Feature Description
      1. 7.3.1 Beyond the Supply
      2. 7.3.2 Bidirectional Operation
      3. 7.3.3 Over Temperature Protection
      4. 7.3.4 Power-Off Protection
      5. 7.3.5 1.8V Logic Compatible Inputs
      6. 7.3.6 Fail-Safe Logic
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Audio Amplifier Switching
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information
    1. 11.1 Packaging Option Addendum
    2. 11.2 Tape and Reel Information
    3. 11.3 Mechanical Data

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • YBH|9
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.3 Thermal Information

THERMAL METRIC(1) TMUX4827 UNIT
(YBH)
9 PINS
RθJA Junction-to-ambient thermal resistance  106 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 0.4 °C/W
RθJB Junction-to-board thermal resistance 31.2 °C/W
ΨJT Junction-to-top characterization parameter 0.2 °C/W
ΨJB Junction-to-board characterization parameter 31.1 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.