SCDS454 January   2024 TMUX7208M

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Thermal Information
    4. 6.4  Recommended Operating Conditions
    5. 6.5  Source or Drain Continuous Current
    6. 6.6  ±15V Dual Supply: Electrical Characteristics 
    7. 6.7  ±15V Dual Supply: Switching Characteristics 
    8. 6.8  ±20V Dual Supply: Electrical Characteristics
    9. 6.9  ±20V Dual Supply: Switching Characteristics
    10. 6.10 44V Single Supply: Electrical Characteristics 
    11. 6.11 44V Single Supply: Switching Characteristics 
    12. 6.12 12 V Single Supply: Electrical Characteristics 
    13. 6.13 12 V Single Supply: Switching Characteristics 
    14. 6.14 Typical Characteristics
  8. 7 Parameter Measurement Information
    1. 7.1  On-Resistance
    2. 7.2  Off-Leakage Current
    3. 7.3  On-Leakage Current
    4. 7.4  Transition Time
    5. 7.5  tON(EN) and tOFF(EN)
    6. 7.6  Break-Before-Make
    7. 7.7  tON (VDD) Time
    8. 7.8  Propagation Delay
    9. 7.9  Charge Injection
    10. 7.10 Off Isolation
    11. 7.11 Crosstalk
    12. 7.12 Bandwidth
    13. 7.13 THD + Noise
    14. 7.14 Power Supply Rejection Ratio (PSRR)
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Bidirectional Operation
      2. 8.3.2 Rail-to-Rail Operation
      3. 8.3.3 1.8 V Logic Compatible Inputs
      4. 8.3.4 Integrated Pull-Down Resistor on Logic Pins
      5. 8.3.5 Fail-Safe Logic
      6. 8.3.6 Latch-Up Immune
      7. 8.3.7 Ultra-Low Charge Injection
    4. 8.4 Device Functional Modes
    5. 8.5 Truth Tables
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • PW|16
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5 Pin Configuration and Functions

GUID-545C3600-78F1-4827-A4D8-6BA5B9613A44-low.gifFigure 5-1 TMUX7208M: PW Package, 16-Pin TSSOP (Top View)
Table 5-1 TMUX7208M Pin Functions
PIN TYPE(1) DESCRIPTION(2)
NAME PW RUM
A0 1 15 I Logic control input, has internal 4MΩ pull-down resistor. Controls the switch configuration as shown in Section 8.5.
A1 16 14 I Logic control input, has internal 4MΩ pull-down resistor. Controls the switch configuration as shown in Section 8.5.
A2 15 13 I Logic control input, has internal 4MΩ pull-down resistor. Controls the switch configuration as shown in Section 8.5.
D 8 6 I/O Drain pin. Can be an input or output.
EN 2 16 I Active high logic enable, has internal 4MΩ pull-down resistor. When this pin is low, all switches are turned off. When this pin is high, the Ax logic input determines which switch is turned on.
GND 14 12 P Ground (0V) reference.
S1 4 2 I/O Source pin 1. Can be an input or output.
S2 5 3 I/O Source pin 2. Can be an input or output.
S3 6 4 I/O Source pin 3. Can be an input or output.
S4 7 5 I/O Source pin 4. Can be an input or output.
S5 12 10 I/O Source pin 5. Can be an input or output.
S6 11 9 I/O Source pin 6. Can be an input or output.
S7 10 8 I/O Source pin 7. Can be an input or output.
S8 9 7 I/O Source pin 8. Can be an input or output.
VDD 13 11 P Positive power supply. This pin is the most positive power-supply potential. For reliable operation, connect a decoupling capacitor ranging from 0.1μF to 10μF between VDD and GND.
VSS 3 1 P Negative power supply. This pin is the most negative power-supply potential. In single-supply applications, this pin can be connected to ground. For reliable operation, connect a decoupling capacitor ranging from 0.1μF to 10μF between VSS and GND.
Thermal Pad — The thermal pad is not connected internally. No requirement to solder this pad, if connected it is recommended that the pad be left floating or tied to GND.
(1) I = input, O = output, I/O = input and output, P = power.
(2) Refer to Section 8.4 for what to do with unused pins.